UC2844BNG ON Semiconductor, UC2844BNG Datasheet - Page 7
![IC CTRLR CURRENT MODE HP 8-DIP](/photos/6/58/65804/8-dip_626-05_sml.jpg)
UC2844BNG
Manufacturer Part Number
UC2844BNG
Description
IC CTRLR CURRENT MODE HP 8-DIP
Manufacturer
ON Semiconductor
Type
Pulse Width Modulator Controllerr
Specifications of UC2844BNG
Pwm Type
Current Mode
Number Of Outputs
1
Frequency - Max
275kHz
Duty Cycle
50%
Voltage - Supply
11 V ~ 25 V
Buck
No
Boost
Yes
Flyback
Yes
Inverting
Yes
Doubler
No
Divider
No
Cuk
No
Isolated
Yes
Operating Temperature
-25°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Frequency-max
275kHz
Duty Cycle (max)
48 %
Output Voltage
4.95 V to 5.05 V
Output Current
1000 mA
Mounting Style
Through Hole
Switching Frequency
500 KHz
Operating Supply Voltage
30 V
Maximum Operating Temperature
+ 85 C
Fall Time
50 ns
Minimum Operating Temperature
- 25 C
Rise Time
50 ns
Synchronous Pin
No
Topology
Boost, Flyback
Current, Input Bias
-2 μA
Current, Output
+12 mA (Sink), -1 mA (Source)
Current, Supply
30 mA
Frequency, Oscillator
250 kHz
Package Type
PDIP-8
Power Dissipation
1.25 W
Regulation, Line
2 mV
Regulation, Load
3 mV
Regulator Type
DC-DC
Temperature, Operating, Range
-25 to +85 °C
Time, Fall
50 ns
Time, Rise
50 ns
Voltage, Gain
3 V/V
Voltage, Input
-0.3 to +5.5 V
Voltage, Noise
50 μV
Voltage, Output
5 V
Voltage, Output, High
13.5 V
Voltage, Output, Low
1.6 V
Voltage, Supply
36 V
Voltage, Supply, Rejection Ratio
70 dB
Rohs Compliant
YES
Number Of Pwm Outputs
1
On/off Pin
No
Adjustable Output
No
Switching Freq
500kHz
Operating Supply Voltage (max)
30V
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UC2844BNG
Manufacturer:
ON Semiconductor
Quantity:
20 000
Part Number:
UC2844BNG
Manufacturer:
ON/安森美
Quantity:
20 000
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
*For additional information on our Pb−Free strategy and soldering
Y
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
Y
M
N
CASE 751−07
SOIC−8 NB
X 45
ISSUE AH
_
M
19
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
UC3844B/D
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_