NCP5173MNR2 ON Semiconductor, NCP5173MNR2 Datasheet

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NCP5173MNR2

Manufacturer Part Number
NCP5173MNR2
Description
IC PWM BUCK BST FLYBCK INV 8DIP
Manufacturer
ON Semiconductor
Type
Step-Up (Boost), Inverting, Flyback, Forward Converter, Sepic, PWM - Current Moder
Datasheet

Specifications of NCP5173MNR2

Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
Adjustable
Current - Output
1.5A
Frequency - Switching
560kHz
Voltage - Input
2.7 ~ 30 V
Operating Temperature
0°C ~ 125°C
Mounting Type
*
Package / Case
8-TDFN Exposed Pad
Voltage - Supply
2.7 V ~ 30 V
Frequency-max
1MHz
Duty Cycle
90%
Pwm Type
Current Mode
Buck
Yes
Boost
Yes
Flyback
Yes
Inverting
Yes
Doubler
No
Divider
No
Cuk
No
Isolated
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NCP5173MNR2OS
NCP5173
1.5 A 560 kHz−1.0 MHz
Boost Regulator
integrated switch. It runs at a base frequency of 560 kHz and can be
synchronized to an external clock up to 1.0 MHz. This part operates
over a wide input voltage range, from 2.7 V to 30 V. The flexibility of
the design allows the chip to operate in most power supply
configurations, including boost, flyback, forward, inverting, and
SEPIC. The IC uses current mode architecture, which allows excellent
load and line regulation, as well as a practical means for limiting
current. Combining high frequency operation with a highly integrated
regulator circuit results in an extremely compact power supply
solution. The circuit design includes provisions for features such as
frequency synchronization, shutdown, and feedback controls for
positive voltage regulation.
Features
Applications
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 2
The NCP5173 is a switching regulator with a high efficiency, 1.5 A
Overcurrent Condition
Integrated Power Switch: 1.5 A Guaranteed
Wide Input Range: 2.7 V to 30 V
High Frequency Allows for Small Components
Minimum External Components
Easy External Synchronization
Built−in Overcurrent Protection
Frequency Foldback Reduces Component Stress During an
Thermal Shutdown with Hysteresis
Low 1.0 mm Maximum Profile
Shut Down Current: 50 mA Maximum
Flat Panel Displays
Systems Requiring Low Profile Components
1
NOTE:
NCP5173MN
NCP5173MNR2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Device
CASE 505AC
MN SUFFIX
Thermal pad is electrically isolated from IC
and all pins.
ORDERING INFORMATION
5x6 QFN
NCP5173 = Specific Device Code
A
WL
YY
WW
http://onsemi.com
Package
QFN
QFN
= Assembly Location
= Wafer Lot
= Year
= Work Week
Publication Order Number:
1
2500 Tape & Reel
MARKING
DIAGRAM
AWLYYWW
95 Units/Rail
NCP5173
MC74HC14A/D
Shipping

Related parts for NCP5173MNR2

NCP5173MNR2 Summary of contents

Page 1

... NOTE: Thermal pad is electrically isolated from IC and all pins. ORDERING INFORMATION Device Package NCP5173MN QFN NCP5173MNR2 QFN †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 MARKING DIAGRAM ...

Page 2

MAXIMUM RATINGS* Junction Temperature Range Storage Temperature Range, T STORAGE Package Thermal Resistance: Junction−to−Ambient, R Lead Temperature Soldering: Reflow (Note 1) ESD, Human Body Model Stresses exceeding Maximum Ratings ...

Page 3

ELECTRICAL CHARACTERISTICS Characteristic Positive and Negative Error Amplifiers FB Reference Voltage FB Input Current FB Reference Voltage Line Regulation Error Amp Transconductance Error Amp Gain V Source Current C V Sink Current C V High Clamp Voltage C V Low ...

Page 4

ELECTRICAL CHARACTERISTICS Characteristic General Operating Current Shutdown Mode Current Minimum Operation Input Voltage Thermal Shutdown Thermal Hysteresis 3. Guaranteed by design, not 100% tested in production. PIN FUNCTION DESCRIPTION Pin Number Symbol 1 V Loop compensation pin. The V C ...

Page 5

V CC Shutdown 2.0 V Regulator Delay Timer Sync SS 0.4 V Detector − Positive Error Amp 1.276 V AGND Thermal Shutdown S PWM Oscillator Q Latch R Frequency Shift 5:1 Slope Compensation PWM Comparator + − V ...

Page 6

TYPICAL PERFORMANCE CHARACTERISTICS 7.2 7.0 6.8 6.6 6.4 6.2 6.0 5.8 5 Temperature (°C) Figure 3. I (No Switching) vs. Temperature CC 1200 1000 800 600 400 200 0 500 I (mA) SW Figure 5. V vs. I ...

Page 7

TYPICAL PERFORMANCE CHARACTERISTICS 1.280 1.278 1.276 1.274 1.272 1.270 1.268 0 50 Temperature (°C) Figure 9. Reference Voltage vs. Temperature 2.60 2.50 2.40 2. 2.20 0 Temperature (°C) ...

Page 8

TYPICAL PERFORMANCE CHARACTERISTICS 160 140 120 100 Temperature (°C) Figure 15. Shutdown Delay vs. Temperature (V) IN Figure 17. I vs. V During Shutdown CC IN 100 60 ...

Page 9

THEORY OF OPERATION Current Mode Control Oscillator − Power Switch PWM Comparator In Out Driver X5 SUMMER 63 mW Slope Compensation Figure 21. Current Mode Control Scheme The NCP5173 incorporates a current mode control ...

Page 10

Switch Driver and Power Switch The switch driver receives a control signal from the logic section to drive the output power switch. The switch is grounded through emitter resistors (63 mW total) to the PGND pin. PGND is not connected ...

Page 11

The low frequency pole determined by the error P1, amplifier output resistance and C1 as 2pC1R O The first zero generated by C1 and R1 is 2pC1R1 The phase lead ...

Page 12

Figure 27. Boost Input Voltage and Current Ripple Waveforms − R ESR Figure 28. Boost Circuit Effective Input Filter The situation is different in a flyback circuit. The input current is discontinuous and ...

Page 13

A simple diode clamp, as shown in Figure 30, clamps the V voltage to a diode drop above the voltage on resistor R3. C Unfortunately, such a simple circuit is not generally acceptable loosely regulated ...

Page 14

The dashed box contains the normal compensation circuitry to limit the bandwidth of the error amplifier. Resistors R2 and R3 form a voltage divider off of the V pin. In normal operation, V looks similar to a square SW wave, ...

Page 15

... Increasing the airflow across the surface of the chip might be considered to reduce T copper “landing pad” can be connected to the ground pin − Designers are referred to ON Semiconductor Application Note AND8036/D for more information on properly sizing a copper area. Circuit Layout Guidelines In any switching power supply, circuit layout is very important for proper operation ...

Page 16

1 GND 47 nF 4.7 nF 2.0 k Figure 34. Additional Application Diagram, 2 Input, +12 V/ 200 mA Output Flyback Converter GND 5.0 k 2.2 mF 200 pF .01 mF ...

Page 17

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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