ADP3209JCPZ-RL ON Semiconductor, ADP3209JCPZ-RL Datasheet - Page 15

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ADP3209JCPZ-RL

Manufacturer Part Number
ADP3209JCPZ-RL
Description
IC CTRLR BUCK 5BIT GMCH 32LFCSP
Manufacturer
ON Semiconductor
Datasheet

Specifications of ADP3209JCPZ-RL

Applications
Controller, Power Supplies for Next-Generation Intel Processors
Voltage - Input
4.5 ~ 5.5 V
Number Of Outputs
1
Voltage - Output
0.4 ~ 1.25 V
Operating Temperature
0°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
32-LFCSP
Output Voltage
0.4 V to 1.25 V
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ADP3209JCPZ-RLTR

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Master Clock Frequency in PWM Mode
When the ADP3209 runs in PWM, the clock frequency is set
by an external resistor connected from the RT pin to GND. The
frequency varies with the VID voltage: the lower the VID
voltage, the lower the clock frequency. The variation of clock
frequency with VID voltage maintains constant V
improves power conversion efficiency at lower VID voltages.
Figure 9 shows the relationship between clock frequency and
VID voltage, parameterized by RT resistance.
Switching Frequency in RPM Mode
When the ADP3209 operates in RPM mode, its switching
frequency is controlled by the ripple voltage on the COMP pin.
Each time the COMP pin voltage exceeds the RPM pin voltage
threshold level determined by the VID voltage and the external
resistor connected between RPM and VRPM, an internal ramp
signal is started and DRVH is driven high. The slew rate of the
internal ramp is programmed by the current entering the
RAMP pin. One-third of the RAMP current charges an internal
ramp capacitor (5 pF typical) and creates a ramp. When the
internal ramp signal intercepts the COMP voltage, the DRVH
pin is reset low.
In continuous current mode, the switching frequency of RPM
operation is almost constant. While in discontinuous current
conduction mode, the switching frequency is reduced as a
function of the load current.
DIFFERENTIAL SENSING OF OUTPUT VOLTAGE
The ADP3209 combines differential sensing with a high accuracy
VID DAC, referenced by a precision band gap source and a low
offset error amplifier, to meet the rigorous accuracy requirement
of the Intel IMVP-6+ specification. In steady-state mode, the
combination of the VID DAC and error amplifier maintain the
output voltage for a worst-case scenario within ±8 mV of the
full operating output voltage and temperature range.
The V
pins. FB should be connected through a resistor to the positive
regulation point—the VCC remote sensing pin of the GMCH.
FBRTN should be connected directly to the negative remote
sensing point—the V
VID DAC and precision voltage reference are referenced to
FBRTN and have a typical current of 200 µA for guaranteed
accurate remote sensing.
OUTPUT CURRENT SENSING
The ADP3209 includes a dedicated current sense amplifier (CSA)
to monitor the total output current of the converter for proper
voltage positioning vs. load current and for overcurrent detection.
Sensing the current delivered to the load is an inherently more
accurate method than detecting peak current or sampling the
CCGFX
output voltage is sensed between the FB and FBRTN
SS
sensing point of the GMCH. The internal
CCGFX
ripple and
Rev. 2 | Page 15 of 32 | www.onsemi.com
current across a sense element, such as the low-side MOSFET.
The current sense amplifier can be configured several ways,
depending on system optimization objectives, and the current
information can be obtained by
At the positive input of the CSA, the CSREF pin is connected to
the output voltage. At the negative input (that is, the CSFB pin of
the CSA), signals from the sensing element (in the case of inductor
DCR sensing, signals from the switch node side of the output
inductors) are connected with a resistor. The feedback resistor
between the CSCOMP and CSFB pins sets the gain of the current
sense amplifier, and a filter capacitor is placed in parallel with
this resistor. The current information is then given as the voltage
difference between the CSCOMP and CSREF pins. This signal
is used internally as a differential input for the current limit
comparator.
An additional resistor divider connected between the CSCOMP
and CSREF pins with the midpoint connected to the LLINE pin
can be used to set the load line required by the GMCH specifi-
cation. The current information to set the load line is then given
as the voltage difference between the LLINE and CSREF pins. This
configuration allows the load line slope to be set independent
from the current limit threshold. If the current limit threshold and
load line do not have to be set independently, the resistor divider
between the CSCOMP and CSREF pins can be omitted and the
CSCOMP pin can be connected directly to LLINE. To disable
voltage positioning entirely (that is, to set no load line), LLINE
should be tied to CSREF.
To provide the best accuracy for current sensing, the CSA has a
low offset input voltage and the sensing gain is set by an external
resistor ratio.
ACTIVE IMPEDANCE CONTROL MODE
To control the dynamic output voltage droop as a function of
the output current, the signal that is proportional to the total
output current, converted from the voltage difference between
LLINE and CSREF, can be scaled to be equal to the required
droop voltage. This droop voltage is calculated by multiplying
the droop impedance of the regulator by the output current.
This value is used as the control voltage of the PWM regulator.
The droop voltage is subtracted from the DAC reference output
voltage, and the resulting voltage is used as the voltage positioning
setpoint. The arrangement results in an enhanced feedforward
response.
Output inductor ESR sensing without the use of a
thermistor for the lowest cost
Output inductor ESR sensing with the use of a thermistor
that tracks inductor temperature to improve accuracy
Discrete resistor sensing for the highest accuracy

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