LM3677TLX-2.5/NOPB National Semiconductor, LM3677TLX-2.5/NOPB Datasheet - Page 4
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LM3677TLX-2.5/NOPB
Manufacturer Part Number
LM3677TLX-2.5/NOPB
Description
IC CONV DC/DC 600MA 2.5V 5USMD
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
Step-Down (Buck)r
Datasheet
1.LM3677LEE-1.2NOPB.pdf
(24 pages)
Specifications of LM3677TLX-2.5/NOPB
Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
2.5V
Current - Output
600mA
Frequency - Switching
3MHz
Voltage - Input
2.7 ~ 5.5 V
Operating Temperature
-30°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
5-MicroSMD
Power - Output
1.18W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM3677TLX-2.5
www.national.com
V
V
V
I
I
R
R
I
V
V
I
F
SHDN
Q
LIM
EN
OSC
IN
FB
REF
IH
IL
DSON (P)
DSON (N)
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
If Military/Aerospace specified devices are required, please
contact the National Semiconductor Sales Office/Distributor
for availability and specifications.
Electrical Characteristics
Limits in boldface type apply over the operating ambient temperature range (−30°C
specifications apply to the LM3677 with V
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 3: All voltages are with respect to the potential at the GND pin.
Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 6: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T
the application (P
− (θ
Note 7: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Value specified here 85 °C/W is based on measurement results using a 4 layer board as per JEDEC
standards.
Note 8: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects
open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor
current measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 9: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 10: The parameters in the electrical characteristic table are tested under open loop conditions at V
over the input voltage range and closed loop condition, refer to the datasheet curves.
Note 11: For output voltage 1.2V or lower, input voltage needs to be derated to the range of 2.7V to 5.0V in order to perform within specification.
V
FB, SW, EN Pin:
Continuous Power Dissipation
(Note 4)
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature
Symbol
J
= 130°C (typ.).
IN
JA
Pin: Voltage to GND
x P
(Soldering, 10 sec.)
D-MAX
). Refer to Dissipation rating table for P
Input Voltage (Note 11)
Feedback Voltage (TL)
Feedback Voltage (LE)
Internal Reference Voltage
Shutdown Supply Current
DC Bias Current into V
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Switch Peak Current Limit
Logic High Input
Logic Low Input
Enable (EN) Input Current
Internal Oscillator Frequency
D-MAX
) and the junction to ambient thermal resistance of the package (θ
J-MAX
Parameter
A-MAX
)
) is dependent on the maximum operating junction temperature (T
IN
IN
Internally Limited
−65°C to +150°C
D-MAX
= EN = 3.6V.
(Note 3)
(GND−0.2V) to
−0.2V to 6.0V
(Note 2)
(V
values at different ambient temperatures.
IN
EN = 0V
No load, device is not switching
V
V
Open Loop(Note 8)
PWM Mode
+125°C
IN
IN
+ 0.2V)
,
260°C
= V
= V
(Note 9)
GS
GS
= 3.6V, I
= 3.6V, I
4
,
PWM mode
Condition
(Note 10)
Operating Ratings
Thermal Properties
SW
SW
ESD Rating (Note 5)
Input Voltage Range
Recommended Load Current
Junction Temperature (T
Ambient Temperature (T
6)
Junction-to-Ambient Thermal
Resistance (θ
Human Body Model: All Pins
Machine Model: All Pins
= 100mA
= -100mA
JA
) in the application, as given by the following equation: T
Limits in standard typeface are for T
JA
IN
) (Note 7)
≤
J-MAX
= 3.6V unless otherwise specified. For performance
T
A
), the maximum power dissipation of the device in
≤
+85°C). Unless otherwise noted,
A
J
) Range
) Range (Note
1085
Min
-2.5
-4.0
2.7
1.0
2.5
J
= 150°C (typ.) and disengages at
(Note 2)
1220
0.01
0.01
Typ
350
150
0.5
16
3
,
−30°C to +125°C
0 mA to 600 mA
−30°C to +85°C
(Note 3)
1375
Max
+2.5
+4.0
J
450
250
5.5
0.4
3.5
35
2.7V to 5.5V
= T
1
1
A-MAX
A
85°C/W
= 25°C.
2.0 kV
= T
200V
Units
MHz
J-MAX
mΩ
mΩ
mA
µA
µA
µA
%
V
V
V
V