LM2670SX-ADJ/NOPB National Semiconductor, LM2670SX-ADJ/NOPB Datasheet - Page 5

• Manufacturer Part Number: LM2670SX-ADJ/NOPB
• Description: IC REG SW ADJ 3A STP DN TO-263-7
• Manufacturer: National Semiconductor
• Series: SIMPLE SWITCHER®r
• Type: Step-Down (Buck)r

Specifications of LM2670SX-ADJ/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1.2 ~ 37 V
• Current - Output: 3A
• Frequency - Switching: 260kHz
• Voltage - Input: 8 ~ 40 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: D²Pak, TO-263 (7 leads + tab)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Other names: *LM2670SX-ADJ; *LM2670SX-ADJ/NOPB; LM2670SX-ADJ

Note 2: ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3: Typical values are determined with T
= T
= 25°C and represent the most likely norm.
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J
Note 4: All limits are guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100%
tested during production with T
= T
= 25°C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC)
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J
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 5: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a
PC board with minimum copper area.
Note 6: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC
board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Note 7: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as
the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 8: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 9: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times
the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers
Made Simple
®
software.
Note 10: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle.
Note 11: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die
attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187.
Note 12: The absolute maximum specification of the 'Switch Voltage to Ground' applies to DC voltage. An extended negative voltage limit of -8V applies to a
pulse of up to 20 ns, -6V of 60 ns and -3V of up to 100 ns.
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