LM2673SX-12/NOPB National Semiconductor, LM2673SX-12/NOPB Datasheet - Page 5
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LM2673SX-12/NOPB
Manufacturer Part Number
LM2673SX-12/NOPB
Description
IC REG SW 12V 3A STP DN TO-263-7
Manufacturer
National Semiconductor
Series
SIMPLE SWITCHER®r
Type
Step-Down (Buck)r
Datasheet
1.LM2673SD-12NOPB.pdf
(26 pages)
Specifications of LM2673SX-12/NOPB
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
12V
Current - Output
3A
Frequency - Switching
260kHz
Voltage - Input
8 ~ 40 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (7 leads + tab)
For Use With
LM2673-5.0EVAL - EVALUATION BOARD FOR LM2673-5.0
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Other names
*LM2673SX-12
*LM2673SX-12/NOPB
LM2673SX-12
*LM2673SX-12/NOPB
LM2673SX-12
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings indicate conditions under which of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test condition, see the electrical
Characteristics tables.
Note 2: ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3: Typical values are determined with T
= T
= 25°C and represent the most likely norm.
A
J
Note 4: All limits are guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100%
tested during production with T
= T
= 25°C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC)
A
J
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 5: The peak switch current limit is determined by the following relationship: I
=37,125/ R
.
CL
ADJ
Note 6: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a
PC board with minimum copper area.
Note 7: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC
board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Note 8: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as
the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 9: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 10: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times
the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers
Made Simple
®
software.
Note 11: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle.
Note 12: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die
attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187.
Note 13: The absolute maximum specification of the 'Switch Voltage to Ground' applies to DC voltage. An extended negative voltage limit of -8V applies to a
pulse of up to 20 ns, -6V of 60 ns and -3V of up to 100 ns.
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