NCP5212AMNTXG ON Semiconductor, NCP5212AMNTXG Datasheet - Page 5
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NCP5212AMNTXG
Manufacturer Part Number
NCP5212AMNTXG
Description
IC CTLR SYNC SGL STEPDOWN 16-QFN
Manufacturer
ON Semiconductor
Type
Step-Down (Buck)r
Datasheet
1.NCP5212AMNTXG.pdf
(19 pages)
Specifications of NCP5212AMNTXG
Internal Switch(s)
No
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
0.8 ~ 3.3 V
Frequency - Switching
300kHz
Voltage - Input
4.5 ~ 27 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Output Voltage
0.8 V to 3.3 V
Output Current
35 uA
Input Voltage
4.5 V to 27 V
Supply Current
35 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output
-
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NCP5212AMNTXG
Manufacturer:
ON Semiconductor
Quantity:
12 000
Part Number:
NCP5212AMNTXG
Manufacturer:
ON/安森美
Quantity:
20 000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE:
1. Internally limited by thermal shutdown, 150°C min.
PIN FUNCTION DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
VCC Power Supply Voltage to AGND
VIN Supply to AGND
High−side Gate Drive Supply: BST to SWN
High−side Gate Drive Voltage: DH to SWN
Low−side Gate Drive Supply: VCCP to PGND
Low−side Gate Drive Voltage: DL to PGND
Input / Output Pins to AGND
Switch Node SWN−PGND
High−Side Gate Drive/Low−Side Gate Drive Outputs
PGND
Thermal Characteristics
Thermal Resistance Junction−to−Ambient (QFN16 Package)
Operating Junction Temperature Range (Note 1)
Operating Ambient Temperature Range
Storage Temperature Range
Moisture Sensitivity Level
Pin No.
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
This device is ESD sensitive. Use standard ESD precautions when handling.
DL/TRESET
IDRP/OCP
PGOOD
Symbol
CS−/Vo
COMP
PGND
VCCP
TPAD
SWN
VCC
SYN
CS+
BST
VIN
DH
EN
FB
Input voltage used for feed forward in switcher operation.
Supply for analog circuit
Synchronization interleaving use.
This pin serves as two functions. Enable: Logic control for enabling the switcher. MASTER/SLAVE: To
program the device as MASTER or SLAVE mode at dual device operation.
Output of the error amplifier.
Output voltage feed back.
Current limit programmable and setting for AVP.
Inductor current differential sense inverting input.
Inductor current differential sense non−inverting input.
Ground reference and high−current return path for the bottom gate driver.
Gate driver output of bottom N−channel MOSFET. It also has the function for TRE threshold setting.
Supply for bottom gate driver.
Top gate driver input supply, a bootstrap capacitor connection between SWN and this pin.
Gate driver output of top N−channel MOSFET.
Switch node between top MOSFET and bottom MOSFET.
Power good indicator of the output voltage. High impendence if power good (in regulation). Low im-
pendence if power not good.
Copper pad on bottom of IC used for heat sinking. This pin should be connected to the analog ground
plane under the IC.
Rating
http://onsemi.com
5
Description
V
V
V
V
CCP
BST
DL
DH
Symbol
DH, DL
V
V
R
−V
MSL
V
PGND
V
T
V
−V
−V
SWN
−V
T
T
qJA
CC
stg
IO
IN
A
J
PGND,
SWN,
PGND,
SWN,
−5 V (< 100 ns)
−40 to + 150
− 55 to +150
− 40 to + 85
−0.3, 6.0
−0.3, 6.0
−0.3, 6.0
−0.3, 0.3
−0.3, 30
−3(DC)
Value
30 V
48
1
°C/W
Unit
°C
°C
°C
V
V
V
V
V
V
V
−