LM2575D2T-012G ON Semiconductor, LM2575D2T-012G Datasheet - Page 18
![IC REG SW 1A 12V STEPDWN D2PAK](/photos/36/39/363977/to263-5_sml.jpg)
LM2575D2T-012G
Manufacturer Part Number
LM2575D2T-012G
Description
IC REG SW 1A 12V STEPDWN D2PAK
Manufacturer
ON Semiconductor
Type
Step-Down (Buck)r
Datasheet
1.LM2575T-5G.pdf
(28 pages)
Specifications of LM2575D2T-012G
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
12V
Current - Output
1A
Frequency - Switching
52kHz
Voltage - Input
4.75 ~ 40 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (5 leads + tab)
Output Voltage
12 V
Output Current
1 A
Input Voltage
4.75 V to 40 V
Switching Frequency
52 KHz
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
Duty Cycle (max)
98 %
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM2575D2T-012G
Manufacturer:
ON Semiconductor
Quantity:
135
Output Voltage Ripple and Transients
Source of the Output Ripple
regulator, its output voltage, if left unfiltered, will contain a
sawtooth ripple voltage at the switching frequency. The
output ripple voltage value ranges from 0.5% to 3% of the
output voltage. It is caused mainly by the inductor sawtooth
ripple current multiplied by the ESR of the output capacitor.
Short Voltage Spikes and How to Reduce Them
voltage spikes at the peaks of the sawtooth waveform (see
Figure 24). These voltage spikes are present because of the
fast switching action of the output switch, and the parasitic
inductance of the output filter capacitor. There are some
other important factors such as wiring inductance, stray
capacitance, as well as the scope probe used to evaluate these
transients, all these contribute to the amplitude of these
spikes. To minimize these voltage spikes, low inductance
capacitors should be used, and their lead lengths must be
kept short. The importance of quality printed circuit board
layout design should also be highlighted.
Minimizing the Output Ripple
to enlarge the inductance value of the inductor L1 and/or to
use a larger value output capacitor. There is also another way
to smooth the output by means of an additional LC filter
(20 mH, 100 mF), that can be added to the output (see
Figure 33) to further reduce the amount of output ripple and
transients. With such a filter it is possible to reduce the
output ripple voltage transients 10 times or more. Figure 24
shows the difference between filtered and unfiltered output
waveforms of the regulator shown in Figure 33.
of the converter, while the lower waveform shows the output
ripple voltage filtered by an additional LC filter.
Since the LM2575 is a switch mode power supply
The regulator output voltage may also contain short
Voltage spikes caused by switching action of the output
switch and the parasitic inductance of the output capacitor
In order to minimize the output ripple voltage it is possible
The upper waveform is from the normal unfiltered output
Figure 24. Output Ripple Voltage Waveforms
HORIZONTAL TIME BASE: 10 ms/DIV
GENERAL RECOMMENDATIONS
FILTERED
OUTPUT
VOLTAGE
UNFILTERED
OUTPUT
VOLTAGE
VERTICAL
RESOLUTION:
20 mV/DIV
http://onsemi.com
18
Heatsinking and Thermal Considerations
The Through−Hole Package TO−220
TO−220(T, TV) and a 5−pin surface mount D
There are many applications that require no heatsink to keep
the LM2575 junction temperature within the allowed
operating range. The TO−220 package can be used without
a heatsink for ambient temperatures up to approximately
50°C (depending on the output voltage and load current).
Higher ambient temperatures require some heatsinking,
either to the printed circuit (PC) board or an external
heatsink.
The Surface Mount Package D
Heatsinking
designed to be soldered to the copper on the PC board. The
copper and the board are the heatsink for this package and
the other heat producing components, such as the catch
diode and inductor. The PC board copper area that the
package is soldered to should be at least 0.4 in
and ideally should have 2 or more square inches (1300 mm
of 0.0028 inch copper. Additional increasing of copper area
beyond approximately 3.0 in
heat
improvements are needed, double sided or multilayer PC
boards with large copper areas should be considered.
Thermal Analysis and Design
whether or not a heatsink will be required. First determine:
1. P
2. T
3. T
4. R
5. R
(Refer to Absolute Maximum Ratings in this data sheet or
R
dissipated by the LM2575:
where d is the duty cycle and for buck converter
qJC
The LM2575 is available in two packages, a 5−pin
The other type of package, the surface mount D
The following procedure must be performed to determine
The following formula is to calculate the total power
D(max)
A(max
J(max)
qJC
qJA
and R
dissipation
)
qJA
P
maximum regulator power dissipation in
the application.
maximum ambient temperature in the
application.
maximum allowed junction temperature
(125°C for the LM2575). For a conservative
design, the maximum junction temperature
should not exceed 110°C to assure safe
operation. For every additional 10°C
temperature rise that the junction must
withstand, the estimated operating lifetime
of the component is halved.
package thermal resistance junction−case.
package thermal resistance junction−ambient.
D
values).
= (V
significantly.
in
x I
Q
) + d x I
2
(2000 mm
2
PAK and its
Load
If
x V
2
) will not improve
further
sat
2
(or 100 mm
2
PAK(D2T).
2
PAK, is
thermal
2
2
)
)