LM2574N-3.3 ON Semiconductor, LM2574N-3.3 Datasheet - Page 25

• Manufacturer Part Number: LM2574N-3.3
• Description: IC REG SW 0.5A 3.3V OUTPUT 8-DIP
• Manufacturer: ON Semiconductor
• Type: Step-Down (Buck)r

Specifications of LM2574N-3.3

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 3.3V
• Current - Output: 500mA
• Frequency - Switching: 52kHz
• Voltage - Input: 4.75 ~ 40 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: LM2574N-3.3OS

NOTE 2
SEATING
PLANE
−T−
16
H
1
0.25
8
14X
1
16X
F
M
D
e
−A−
B
G
T
A
5
S
0.13 (0.005)
4
D
B
N
9
8
S
−B−
C
A
B
M
K
T
T
SEATING
PLANE
A
M
PACKAGE DIMENSIONS
LM2574, NCV2574
B
http://onsemi.com
M
CASE 751G−03
CASE 626−05
DW SUFFIX
C
SO−16 WB
N SUFFIX
ISSUE C
ISSUE L
PDIP−8
25
L
M
J
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INLCUDE
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PER ASME Y14.5M, 1994.
MOLD PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A1
A
B
C
D
H
E
e
h
L
q
NOTES:
MILLIMETERS
10.15
10.05
1. DIMENSION L TO CENTER OF LEAD WHEN
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
3. DIMENSIONING AND TOLERANCING PER ANSI
2.35
0.10
0.35
0.23
7.40
0.25
0.50
MIN
1.27 BSC
FORMED PARALLEL.
SQUARE CORNERS).
Y14.5M, 1982.
0
DIM
_
A
B
C
D
G
H
K
M
N
F
J
L
10.45
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
7
MILLIMETERS
MIN
9.40
6.10
3.94
0.38
1.02
0.76
0.20
2.92
0.76
−−−
_
2.54 BSC
7.62 BSC
10.16
MAX
6.60
4.45
0.51
1.78
1.27
0.30
3.43
1.01
10
_
0.370
0.240
0.155
0.015
0.040
0.030
0.008
0.030
0.115
MIN
−−−
0.100 BSC
0.300 BSC
INCHES
0.400
0.260
0.175
0.020
0.070
0.050
0.012
0.135
0.040
MAX
10
_