NCP1450ASN27T1G ON Semiconductor, NCP1450ASN27T1G Datasheet - Page 22

IC CTRLR DC-DC PWM 2.7V SOT23-5

NCP1450ASN27T1G

Manufacturer Part Number
NCP1450ASN27T1G
Description
IC CTRLR DC-DC PWM 2.7V SOT23-5
Manufacturer
ON Semiconductor
Type
Step-Up (Boost), Inverting, Flyback, Forward Converter, Sepicr
Datasheet

Specifications of NCP1450ASN27T1G

Internal Switch(s)
No
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
2.7V
Current - Output
1A
Frequency - Switching
180kHz
Voltage - Input
0.6 ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
TSOT-23-5, TSOT-5, TSOP-5
Power - Output
500mW
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NCP1450ASN27T1GOS
NCP1450ASN27T1GOS
NCP1450ASN27T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCP1450ASN27T1G
Manufacturer:
ON Semiconductor
Quantity:
2 200
Part Number:
NCP1450ASN27T1G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.05 (0.002)
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
S
H
1
D
5
L
A
2
G
4
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
B
0.039
1.0
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
0.037
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
K
NCP1450A
SN SUFFIX
ISSUE E
TSOP−5
0.074
1.9
22
J
0.028
0.7
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. A AND B DIMENSIONS DO NOT INCLUDE
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
0
_
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
10
3.00
_
0.0512
0.0354
0.0098
0.0335
0.0005
0.0040
0.0079
0.0493
0.0985
0.1142
MIN
0
INCHES
_
0.1220
0.0669
0.0433
0.0197
0.0413
0.0040
0.0102
0.0236
0.0610
0.1181
MAX
10
_
NCP1450A/D

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