HCS365T-I/SM Microchip Technology, HCS365T-I/SM Datasheet - Page 27

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HCS365T-I/SM

Manufacturer Part Number
HCS365T-I/SM
Description
IC CODE HOPP ENCODR 15FUNC 8SOIJ
Manufacturer
Microchip Technology
Type
Code Hopping Encoderr
Datasheets

Specifications of HCS365T-I/SM

Applications
Remote Secure Access, Keyless Entry
Mounting Type
Surface Mount
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCS365T-I/SM
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
HCS365T-I/SM
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
10.0
Package Type:
2002 Microchip Technology Inc.
PACKAGING INFORMATION
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
D
p
A
E
L
B
n
c
c
D
MIN
Preliminary
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
HCS365
p
A2
DS41109D-page 27
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15

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