HCS370T/SL Microchip Technology, HCS370T/SL Datasheet - Page 9
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HCS370T/SL
Manufacturer Part Number
HCS370T/SL
Description
IC CODE HOP ENCODR 15FUNC 14SOIC
Manufacturer
Microchip Technology
Type
Code Hopping Encoderr
Specifications of HCS370T/SL
Applications
Remote Secure Access, Keyless Entry
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCS370T/SL
Manufacturer:
MICROCHIP
Quantity:
12 000
TABLE 3-3:
2002 Microchip Technology Inc.
TABLE 3-2:
KEY2
SEED2
SYNC2
SER2
DISC2
MSEL2
HSEL2
XSER2
QUEN2
STEN2
LEDBL2
LEDOS2
SDLM2
SDMD2
SDBT2
SDTM2
BSEL2
GSEL2
Note 1: All Timing values vary ±10%.
Symbol
Address
2A: 7654 ----
3E: ---- 32--
3E: --54 ----
3E: 76-- ----
32: ---- 32--
3D: -6-- ----
3D: 7--- ----
32: ---4 ----
32: --5- ----
32: -6-- ----
32: 7--- ----
3E: ---- ---0
3E: ---- --1-
2A: 60 bits
34: 64 bits
08: 20 bits
08: 18 bits
26: 32 bits
32: 10 bits
DEVICE OPTIONS
ENCODER2 OPTIONS (SHIFT = 1)
16
:Bits
Encoder Key
Encoder Seed Value
Encoder Synchronization Counter (CNTSEL=1)
Encoder Synchronization Counter (CNTSEL=0) plus overflow
Encoder Serial Number
Encoder Discrimination value
Transmission Modulation
Format
Header Select
Extended Serial Number
Queue counter Enable
START/STOP Pulse Enable
Low Voltage LED Blink
LED On Time Select
Limited Seed
Seed Mode
Seed Button Code
Time Before Seed Code word
Transmission Baud Rate
Select
Guard Time Select
(1)
(1)
Preliminary
(1)
Description
(1)
Disable = 0
Disable = 0
Disable = 0
28 bits = 0
50 ms = 0
Never = 0
User = 0
4 T
Value
Value
Value
Value
(1)
00
01
10
11
00
01
10
11
00
01
10
11
00
01
10
11
E
= 0
2
2
2
2
Production = 1
Manchester
100 ms = 1
Enable = 1
Enable = 1
Enable = 1
32 bits = 1
Time (ms)
10 T
Once = 1
Time (s)
Format
VPWM
T
PWM
102.4
PPM
E
2 T
51.2
100
200
400
800
0.0
0.8
1.6
3.2
6.4
( s)
E
E
= 1
HCS370
3.2,
3.2.1
3.2, 3.2.2
4.1
4.1
3.2
5.6
5.3
3.3
4.1
4.1, 5.2
DS41111D-page 9
3.2.1
3.3
3.2,
4.1
5.3
3.3
3.3
3.3
Reference
Section
3.2.1