LDECD3470KA5N00 Kemet, LDECD3470KA5N00 Datasheet - Page 14

• Manufacturer Part Number: LDECD3470KA5N00
• Description: CAP FILM .47UF 50V SMD
• Manufacturer: Kemet
• Series: LDE Arcotronicsr

Specifications of LDECD3470KA5N00

• Capacitance: 0.47µF
• Voltage - Ac: 40V
• Voltage - Dc: 50V
• Dielectric Material: Polyethylene (PEN)
• Tolerance: ±10%
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
• Height: 0.094" (2.40mm)
• Termination: Solder Pads
• Features: General Purpose
• Voltage Rating: 50 Volts
• Dissipation Factor Df: 0.8
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 5.1 mm W x 5.7 mm L x 2.4 mm H
• Product: PEN SMD Film Capacitors
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Esr (equivalent Series Resistance): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-5477-2

in line with JEDEC STD 020D ed. June 2007 with some limitations
These new landing area dimensions have the aim of taking full
advantage of the new RoHS 6 terminations design.
The preceding layout (2004 Catalogue) is therefore to be
considered still valid, although not optimal for RoHS 6.
Soldering recommendations and cautions
Preheating
Maximum temperature on the component’s body (T
** For customized sizes, specific landing areas suggestions are available
07/2008
H
Capacitor
1.6 - 2.5
Size
Maximum preheating time: 180 s
Minimum temperature: 150 °C
Maximum temperature: 200 °C
max
12.06
12.10
18.12
22.20
28.24
40.30
50.40
60.54
> 2.5
< 1.6
**
[mm]
A [mm]
12.6
1.5
2.3
3.0
4.6
5.7
7.4
9.6
255 °C *
255 °C *
250 °C
< 350
Capacitor volume [mm
B [mm]
1.1
1.1
1.7
2.1
2.3
2.6
2.6
2.6
Linear profiles are also allowed (if in line with the reflow recommendations)
350 - 2000
255 °C *
250 °C
245 °C
Landing areas and solder paste suggestions
C [mm]
10.7
13.2
2.3
2.3
3.1
3.9
5.3
8.2
Reflow temperature profile
Reflow recommendations
255 °C *
> 2000
245 °C
245 °C
3
]
D [mm]
13.4
15.9
18.4
4.5
4.5
6.5
8.1
9.9
max
):
14
Maximum time within T
Maximum time over 217 °C (∆T
Maximum temperature ramp rate:
Second reflow
*
We suggest to use a Sn / Ag / Cu solder paste (suggested
thickness: 0.10 ÷ 0.15 mm).
If a NOT Lead Free solder paste is used, a minimum peak
temperature of 210 °C on the component’s body is suggested.
For LDB series this value is 260 °C.
30 s (T
10 s (250 °C < T
3 °C / s (heating)
6 °C / s (cooling)
if two reflow processes are needed, be sure that, before
the second reflow, the temperature on the capacitor’s
surface is lower than 50 °C.
max
≤ 250 °C)
max
≤ 255 °C
max
SMD Film Capacitors
and T
217
*
)
max
): 150 s
- 5 °C (∆T
5
):