HCPL-0453-000E Avago Technologies US Inc., HCPL-0453-000E Datasheet - Page 6

• Manufacturer Part Number: HCPL-0453-000E
• Description: OPTOCOUPLER TRANS-OUT 1MBD 8SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0453-000E

• Input Type: DC
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 1Mbps
• Propagation Delay High - Low @ If: 200ns @ 16mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 8 mA
• Maximum Forward Diode Current: 25 mA
• Output Device: Transistor With Base
• Configuration: 1 Channel
• Current Transfer Ratio: 50 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 16mA
• Output Voltage: 20V
• Opto Case Style: SOIC
• No. Of Pins: 8
• Ctr Max: 50%
• Ctr Min: 19%
• Rohs Compliant: Yes
• Number Of Elements: 1
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.7V
• Forward Current: 25mA
• Package Type: SOIC
• Collector Current (dc) (max): 8mA
• Power Dissipation: 100mW
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: -55C to 100C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1528-5

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4502/3)
Solder Reflow Temperature Profile
6
(0.070 ± 0.006)
TEMPERATURE
1.78 ± 0.15
ROOM
300
200
100
Dimensions in millimeters (inches).
Lead coplanarity = 0.10 mm (0.004 inches).
Note: Floating lead protrusion is 0.25 mm (10 mils) max.
0
0
Note: Non-halide flux should be used.
8
1
160°C
150°C
140°C
(0.442 ± 0.006)
11.15 ± 0.15
PREHEATING RATE
3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE
2.5°C ± 0.5°C/SEC.
7
2
6
3
(0.100)
2.54
BSC
50
3°C + 1°C/–0.5°C
4
5
150°C, 90 + 30 SEC.
PREHEATING TIME
(0.061)
MAX.
1.55
(0.354 ± 0.006)
(0.158) MAX.
9.00 ± 0.15
2.5 C ± 0.5°C/SEC.
4.00
100
(0.030 ± 0.010)
0.75 ± 0.25
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
TEMP.
245°C
PEAK
150
(0.051)
1.3
(0.039 ± 0.006)
SEC.
30
(0.484 ± 0.012)
SEC.
1.00 ± 0.15
30
(0.433)
12.30 ± 0.30
11.00
50 SEC.
SOLDERING
MAX.
200°C
TIME
200
PEAK
TEMP.
240°C
(0.09)
2.29
7° NOM.
TIGHT
TYPICAL
LOOSE
TEMP.
230°C
PEAK
(0.534)
13.56
(0.010 + 0.003)
0.254 + 0.076
250
- 0.0051
- 0.002)