HCPL-T250#560 Avago Technologies US Inc., HCPL-T250#560 Datasheet - Page 4

• Manufacturer Part Number: HCPL-T250#560
• Description: OPTOCOUPLER DRIVER 1.5A VDE 8SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-T250#560

• Output Type: Push-Pull, Totem-Pole
• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 1.5A
• Propagation Delay High - Low @ If: 270ns @ 7mA ~ 16mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Mounting Type: Surface Mount, Gull Wing
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Maximum Propagation Delay Time: 500 ns
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Forward Diode Current: 16 mA
• Maximum Power Dissipation: 250 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 20 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Recommended Pb-Free IR Profile
4
Solder Reflow Thermal Profile
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250