HCPL-T250#560 Avago Technologies US Inc., HCPL-T250#560 Datasheet - Page 4
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HCPL-T250#560
Manufacturer Part Number
HCPL-T250#560
Description
OPTOCOUPLER DRIVER 1.5A VDE 8SMD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-T250-500E.pdf
(7 pages)
Specifications of HCPL-T250#560
Output Type
Push-Pull, Totem-Pole
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
1.5A
Propagation Delay High - Low @ If
270ns @ 7mA ~ 16mA
Current - Dc Forward (if)
25mA
Input Type
DC
Mounting Type
Surface Mount, Gull Wing
Configuration
1 Channel
Isolation Voltage
3750 Vrms
Maximum Propagation Delay Time
500 ns
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Forward Diode Current
16 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 20 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Recommended Pb-Free IR Profile
4
Solder Reflow Thermal Profile
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250