HCPL-2211-060E Avago Technologies US Inc., HCPL-2211-060E Datasheet - Page 10

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HCPL-2211-060E

Manufacturer Part Number
HCPL-2211-060E
Description
OPTOCOUPLER 1CH 5MBD VDE 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-2211-060E

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Fall Time
7 ns
Maximum Rise Time
30 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
5 MBps
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
210 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Baud Rate
5Mbps
Forward Voltage
1.7V
Forward Current
10mA
Output Current
25mA
Package Type
PDIP
Operating Temp Range
-40C to 85C
Power Dissipation
210mW
Propagation Delay Time
300ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-2211-060E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-2211-060E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.
†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.
10
Absolute Maximum Ratings
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Junction Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
Reverse Input Voltage
Average Output Current
Supply Voltage
Output Voltage
Total Package Power Dissipation
Output Power Dissipation
Lead Solder Temperature (Through Hole Parts Only)
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
(≤ 1 µs Pulse Width, 300 pps)
(≤ 200 µs Pulse Width,
< 1% Duty Cycle)
HCPL-223X
HCNW22XX
HCNW22XX
HCPL-223X
HCNW22XX
Symbol
V
I
V
See Package Outline Drawings section
F(ON)
F(OFF)
T
T
N
Symbol
CC
I
260°C for 10 sec., up to seating plane
A
J
I
F(TRAN)
F(AVG)
V
P
T
T
V
V
P
I
CC
O
A
O
R
O
S
T
1.6 mm below seating plane
260°C for 10 sec.,
Min.
1.6*
1.8†
Min.
-0.5
-40
-40
-40
-55
4.5
0
-
See Figure 7
Max.
125
210
294
1.0
85
10
40
25
20
20
5
3
Max.
125
0.8
20
85
5
4
Units
mW
mA
mA
mA
°C
°C
A
V
V
V
TTL Loads
Units
mA
°C
°C
V
V
Note
1
1
1
1
1
2
1

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