HCPL-7710#560 Avago Technologies US Inc., HCPL-7710#560 Datasheet - Page 5
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HCPL-7710#560
Manufacturer Part Number
HCPL-7710#560
Description
OPTOCOUPLER 12MBD VDE 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-7710-000E.pdf
(18 pages)
Specifications of HCPL-7710#560
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
12.5MBd
Propagation Delay High - Low @ If
20ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
10 mA
Maximum Fall Time
8 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
9 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
12.5 MBps
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
5
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition
program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed circuit
board, minimum creepage and clearance requirements
must be met as specified for individual equipment stan-
dards. For creepage, the shortest distance path along the
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
Note: Non-halide flux should be used.
smax
smin
25
T
T
p
L
= 200 °C, T
150 - 200 °C
217 °C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
260 +0/-5 °C
TIME
Symbol
L(I01)
L(I02)
CTI
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
7710
7.1
7.4
0.08
≥175
IIIa
RAMP-DOWN
6 °C/SEC. MAX.
Value
0710
4.9
4.8
0.08
≥175
IIIa
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
surface of a printed circuit board between the solder fillets
of the input and output leads must be considered. There
are recommended techniques such as grooves and ribs
which may be used on a printed circuit board to achieve
desired creepage and clearances. Creepage and clearance
distances will also change depending on factors such as
pollution degree and insulation level.
Volts
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)