HCPL-7611#300 Avago Technologies US Inc., HCPL-7611#300 Datasheet - Page 6
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HCPL-7611#300
Manufacturer Part Number
HCPL-7611#300
Description
OPTOCOUPLER 10MBD 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-7611.pdf
(13 pages)
Specifications of HCPL-7611#300
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
57ns @ 4mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
20 mA
Maximum Rise Time
24 ns
Minimum Forward Diode Voltage
1.2 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
1.85 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Solder Reflow Temperature Profile
6
Recommended Pb-free IR Profile
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
0
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250