HCPL-2219-000E Avago Technologies US Inc., HCPL-2219-000E Datasheet - Page 5
![no-image](/images/manufacturer_photos/0/0/86/avago_technologies_us_inc__sml.jpg)
HCPL-2219-000E
Manufacturer Part Number
HCPL-2219-000E
Description
OPTOCOUPLER 1CH 2.5MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-2200-500E.pdf
(13 pages)
Specifications of HCPL-2219-000E
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
2.5MBd
Propagation Delay High - Low @ If
210ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
25 mA
Maximum Fall Time
15 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
55 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
5 MBps
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
210 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2219-000E
Manufacturer:
AVAGO
Quantity:
5 000
TEMPERATURE
Solder Reflow Thermal Profile
5
Insulation and Safety Related Specifications
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Recommended Pb-Free IR Profile
Parameter
Min. External Air Gap
(External Clearance)
Min. External
Tracking Path
(External Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
Symbol
260 +0/-5 °C
L(IO1)
L(IO2)
PREHEATING TIME
150°C, 90 + 30 SEC.
CTI
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
Value
p
0.08
200
IIIa
7.1
7.4
TEMP.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
SOLDERING
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2200/2219 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.