HCPL-0708-000E Avago Technologies US Inc., HCPL-0708-000E Datasheet
HCPL-0708-000E
Specifications of HCPL-0708-000E
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Related parts for HCPL-0708-000E
HCPL-0708-000E Summary of contents
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... IEC/EN/DIN EN 60747-5 Applications O • Scan drive in PDP 5 GND • Digital field bus isolation: DeviceNet, SDS, Profibus • Multiplexed data transmission • Computer peripheral interface • Microprocessor system interface 3750 V rms for 1 min. per UL 1577 for HCPL-0708 approved for HCPL-0708 Option 060 ...
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... To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example1: HCPL-0708-500E to order product of Small Outline SO-8 package in Tape and Reel packaging and RoHS compliant. Example 2: HCPL-0708 to order product of Small Outline SO-8 package in Tube packaging and non RoHS compliant. ...
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Package Outline Drawing 5.994 ± 0.203 (0.236 ± 0.008) XXXV 3.937 ± 0.127 YWW (0.155 ± 0.005 PIN ONE 0.406 ± 0.076 1.270 (0.016 ± 0.003) (0.050) * 5.080 ± 0.127 (0.200 ...
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... T = 150 °C smax smin Note: Non-halide flux should be used. Regulatory Information The HCPL-0708 has been approved by the following organizations: UL Recognized under UL 1577, component recognition program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA88324. IEC/EN/DIN EN 60747-5-2 Approved under: ...
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Insulation and Safety Related Specifications Parameter Symbol Minimum External Air L(I01) Gap (Clearance) Minimum External L(I02) Tracking (Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance CTI (Comparative Tracking Index) Isolation Group All Avago data sheets report the creepage and ...
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... V O DD2 260°C for 10 sec., 1.6 mm below seating plane See Solder Reflow Temperature Profile Section Symbol Min. T – 4 HCPL-0708 Option 060 Units I-IV I-III 55/85/21 2 560 V peak 1050 V peak 840 V peak 4000 V peak 150 °C 150 mA 600 mW 9 ≥10 Ω ...
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Electrical Specifications Over recommended temperature (T All typical specifications are 25° Parameter Symbol Input Forward Voltage V F Input Reverse BV R Breakdown Voltage Logic High Output V OH Voltage Logic Low Output V OL ...
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Package Characteristics All Typicals 25°C. A Parameter Input-Output Insulation Input-Output Momentary Withstand Voltage Input-Output Resistance Input-Output Capacitance Notes propagation delay is measured from the 50% level on the risiing edge of the input pulse to ...
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... PWD – PULSE INPUT CURRENT – Figure 5. Typical switching speed vs. pulse input current. HCPL-0708 fig 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 - 100 T – TEMPERATURE – °C A Figure 3. Typical logic high O/P supply current vs. temperature. HCPL-0708 fig 3 ...
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... Application Information Bypassing and PC Board Layout The HCPL-0708 optocoupler is extremely easy to use. No external interface circuitry is required because the HCPL- 0708 uses high-speed CMOS IC technology allowing CMOS logic to be connected directly to the inputs and outputs C1 0.01 µF TO 0.1 µF Figure 6. Recommended printed circuit board layout. ...
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... A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. The HCPL-0708 optocouplers offer the advantage of guaranteed specifications for propagation delays, pulse- width distortion, and propagation delay skew over the recommended temperature and power supply ranges ...
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For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright ...