HCPL-0723-560E Avago Technologies US Inc., HCPL-0723-560E Datasheet - Page 5
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HCPL-0723-560E
Manufacturer Part Number
HCPL-0723-560E
Description
OPTOCOUPLER 50MBD 2NS VDE 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-7723-300.pdf
(12 pages)
Specifications of HCPL-0723-560E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
50MBd
Propagation Delay High - Low @ If
16ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
10 mA
Maximum Fall Time
6 ns
Maximum Rise Time
8 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
50 MBps
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Baud Rate
50Mbps
Output Current
10mA
Package Type
SOIC
Operating Temp Range
-40C to 85C
Power Dissipation
150mW
Propagation Delay Time
22ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0723-560E
Manufacturer:
OMRON
Quantity:
2 000
Solder Reflow Temperature Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
5
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
Symbol
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
7723
7.1
7.4
0.08
≥ 175
IIIa
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
Value
150
0723
4.9
4.8
0.08
≥ 175
IIIa
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
Units
mm
mm
mm
Volts
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
250
Regulatory Information
The HCPL-7723/0723 have been
approved by the following organi-
zations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997+A1:2002/
EN 60747-5-2:2001+A1:2002/
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2): 2003-01.