HCPL-7710 Avago Technologies US Inc., HCPL-7710 Datasheet - Page 4
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HCPL-7710
Manufacturer Part Number
HCPL-7710
Description
OPTOCOUPLER CMOS 12MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-7710-000E.pdf
(18 pages)
Specifications of HCPL-7710
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
12.5MBd
Propagation Delay High - Low @ If
20ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Gate Drive
Input Current
10µA
Output Voltage
5V
Opto Case Style
DIP
No. Of Pins
8
Propagation Delay Low-high
40ns
Common Mode Voltage Vcm
1000V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1114-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-7710
Manufacturer:
AVAGO
Quantity:
10 000
Part Number:
HCPL-7710
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-7710#300
Manufacturer:
SHARP
Quantity:
425
Part Number:
HCPL-7710#300
Manufacturer:
AGILENT
Quantity:
20 000
Company:
Part Number:
HCPL-7710#300E
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-7710#500E
Manufacturer:
AVAGO
Quantity:
10 000
Part Number:
HCPL-7710#500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-7710-000E
Manufacturer:
Avago Technologies US Inc.
Quantity:
1 933
Part Number:
HCPL-7710-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-7710-300E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
4
Package Outline Drawing
HCPL-0710 Outline Drawing (Small Outline SO-8 Package)
Solder Reflow Thermal Profile
TEMPERATURE
*
ROOM
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
3.175 ± 0.127
Note: Non-halide flux should be used.
300
200
100
PIN ONE
0
0
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
*
(0.200 ± 0.005)
5.080 ± 0.127
7
2
50
XXXV
YWW
3°C + 1°C/- 0.5°C
6
3
PREHEATING TIME
150°C, 90 + 30 SEC.
5
4
2.5°C ± 0.5°C/SEC.
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
100
TIME (SECONDS)
BSC
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0 ~ 7°
TEMP.
PEAK
245°C
150
7°
(0.012)
0.305
SEC.
SEC.
30
30
LAND PATTERN RECOMMENDATION
MIN.
50 SEC.
45° X
SOLDERING
(0.008 ± 0.004)
200°C
0.203 ± 0.102
TIME
200
(0.017)
0.432
PEAK
TEMP.
240°C
0.64 (0.025)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
(0.009 ± 0.001)
1.9 (0.075)
0.228 ± 0.025
250
7.49 (0.295)