HCPL-263N#300 Avago Technologies US Inc., HCPL-263N#300 Datasheet - Page 5
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HCPL-263N#300
Manufacturer Part Number
HCPL-263N#300
Description
OPTOCOUPLER 2CH 10MBD 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-061A-000E.pdf
(17 pages)
Specifications of HCPL-263N#300
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
53ns @ 3.5mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
12 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
42 ns
Minimum Forward Diode Voltage
1 V
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
1.6 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
60 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
TEMPERATURE
HCPL-061A/061N/063A/063N Outline Drawing
Figure 3. 8-Pin Small Outline Package Device Drawing.
Recommended Pb-Free IR Profile
5
Solder Reflow Thermal Profile
Note: Non-halide flux should be used.
ROOM
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
3.175 ± 0.127
5.207 ± 0.254 (0.205 ± 0.010)
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
* 5.080 ± 0.127
(0.200 ± 0.005)
t 25 °C to PEAK
3 C/SEC. MAX.
60 to 180 SEC.
smin
7
2
PREHEAT
YWW
RAMP-UP
= 150 °C
XXX
6
3
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
5
4
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
2.5 C ± 0.5°C/SEC.
BSC
t
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
LAND PATTERN RECOMMENDATION
7
SEC.
SEC.
30
(0.012)
30
0.305
50 SEC.
MIN.
SOLDERING
0.64 (0.025)
45 X
200°C
TIME
200
(0.008 ± 0.004)
0.203 ± 0.102
PEAK
TEMP.
240°C
(0.017)
0.432
1.9 (0.075)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
7.49 (0.295)
(0.009 ± 0.001)
0.228 ± 0.025
250
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by the
following organizations:
UL
Recognized under UL 1577, Com-
ponent Recognition Program, File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.