HCPL-2411#300 Avago Technologies US Inc., HCPL-2411#300 Datasheet - Page 5
![ISOL 2.5KVRMS 1CH UNIDIR 8SMD GW](/photos/15/83/158318/dual_inline_gull_wing_sml.jpg)
HCPL-2411#300
Manufacturer Part Number
HCPL-2411#300
Description
ISOL 2.5KVRMS 1CH UNIDIR 8SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-2400-300E.pdf
(15 pages)
Specifications of HCPL-2411#300
Package / Case
8-SMD Gull Wing
Voltage - Isolation
2500Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
40MBd
Propagation Delay High - Low @ If
33ns @ 7mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
2500 Vrms
Maximum Continuous Output Current
25 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
20 ns
Minimum Forward Diode Voltage
1.1 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
40 MBps
Maximum Forward Diode Voltage
1.5 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
350 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
5
Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-24XX has been approved by the following organizations:
VDE
Approved according to VDE 0884/06.92 (Option 060
only).
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250