HCPL-817-30LE Avago Technologies US Inc., HCPL-817-30LE Datasheet - Page 4
![OPTOCOUPLER PHOTOTRANS 4-SMD GW](/photos/22/84/228416/4579667_sml.jpg)
HCPL-817-30LE
Manufacturer Part Number
HCPL-817-30LE
Description
OPTOCOUPLER PHOTOTRANS 4-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-817-300E.pdf
(7 pages)
Specifications of HCPL-817-30LE
Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
100% @ 5mA
Voltage - Output
70V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount, Gull Wing
Package / Case
4-SMD Gull Wing
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
20mA
Output Voltage
70V
Opto Case Style
SMD
No. Of Pins
4
Ctr Max
100%
Isolation Voltage
5kV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-817-30LE
Manufacturer:
SANYO
Quantity:
3 400
HCPL-817-300E
LEAD FREE
Absolute Maximum Ratings (T
4
Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
25°C
(1.6 mm below seating plane)
Total Power Dissipation
Storage Temperature, T
Operating Temperature, T
Lead Solder Temperature, max.
Average Forward Current, I
Reverse Input Voltage, V
Input Power Dissipation, P
Collector Current, I
Collector-Emitter Voltage, V
Emitter-Collector Voltage, V
Collector Power Dissipation
Isolation Voltage, V
ANODE
150°C
Dimensions in Millimeters and (Inches)
60 ~ 150 sec
A 817
Y W W
C
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
200°C
S
R
A
I
F
217°C
CEO
Time (sec)
ECO
6.5 ± 0.5
A
(0.256)
= 25°C)
250°C
RANK
90 sec
DATE CODE
60 sec
260°C (Peak Temperature)
1.2 ± 0.1
30 seconds
(0.047)
60 sec
2.54 ± 0.25
4.6 ± 0.5
(0.181)
(0.1)
–55°C to +125°C
–30°C to +100°C
260°C for 10 s
50 mA
6 V
70 mW
50 mA
70 V
6 V
150 mW
200 mW
5000 Vrms
1. One-time soldering reflow is recommended within the
2. When using another soldering method such as infrared
3.5 ± 0.5
(0.138)
condition of temperature and time profile shown.
ray lamp, the temperature may rise partially in the mold
of thedevice. Keep the temperature on the package of
the device within the condition of (1) above.
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
10.16 ± 0.3
7.62 ± 0.3
(0.3)
(0.4)
(0.010)
0.26