HCPL-4562-020E Avago Technologies US Inc., HCPL-4562-020E Datasheet - Page 5
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HCPL-4562-020E
Manufacturer Part Number
HCPL-4562-020E
Description
OPTOCOUPLER ANLG/VID UL 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-4562-000E.pdf
(17 pages)
Specifications of HCPL-4562-020E
Input Type
DC
Package / Case
8-DIP (0.300", 7.62mm)
Number Of Channels
1
Voltage - Isolation
5000Vrms
Voltage - Output
20V
Current - Output / Channel
8mA
Current - Dc Forward (if)
12mA
Output Type
Transistor with Vcc
Mounting Type
Through Hole
Isolation Voltage
5000 Vrms
Minimum Forward Diode Voltage
1.1 V
Output Device
Phototransistor
Configuration
1 Channel
Current Transfer Ratio
45 %
Maximum Forward Diode Voltage
1.6 V
Maximum Reverse Diode Voltage
1.8 V
Maximum Input Diode Current
12 mA
Maximum Power Dissipation
100 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Current Transfer Ratio (min)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-4562-020E
Manufacturer:
TI
Quantity:
1 200
Company:
Part Number:
HCPL-4562-020E
Manufacturer:
AVAGO
Quantity:
10 000
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
T
T
*
smax
smax
smin
400 mils package is 245°C
Recommended peak temperature for widebody
300
200
100
T
T
25
0
p
L
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
50
*
260 +0/-5 °C
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
100
p
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW4562 only)
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250