B32678G1206K EPCOS Inc, B32678G1206K Datasheet - Page 14

• Manufacturer Part Number: B32678G1206K
• Description: CAP 20UF 10% 750V METAL POLYPRO
• Manufacturer: EPCOS Inc
• Series: MKP B32678r

Specifications of B32678G1206K

• Capacitance: 20µF
• Tolerance: ±10%
• Lead Spacing: 2.067" (52.50mm)
• Voltage - Ac: 375V
• Voltage - Dc: 750V
• Dielectric Material: Polypropylene, Metallized
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 2.264" L x 1.378" W (57.50mm x 35.00mm)
• Height: 1.969" (50.00mm)
• Termination: PC Pins
• Features: AC and Pulse
• Voltage Rating: 750 Volts
• Esr: 1.9 mOhms
• Termination Style: Radial
• Dimensions: 35 mm W x 57.5 mm L x 50 mm H
• Operating Temperature Range: - 55 C to + 85 C
• Product: Metallized Polypropylene Capacitors
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-3027; B32678G1206K000

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32674 ... B32678
MKP DC link
max
. Long exposure to temperatures above this type-related temperature limit
high power series
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