TLP621-2 Toshiba, TLP621-2 Datasheet - Page 9
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TLP621-2
Manufacturer Part Number
TLP621-2
Description
PHOTOCOUPLER DUAL TRANS-OUT 8DIP
Manufacturer
Toshiba
Specifications of TLP621-2
Number Of Channels
2
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
2
Isolation Voltage
5kV
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
55V
Opto Case Style
DIP
No. Of Pins
8
Approval Bodies
UL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLP621-2
Manufacturer:
TOSHIBA
Quantity:
3 900
Part Number:
TLP621-2
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Company:
Part Number:
TLP621-2(D4-GB,F)
Manufacturer:
TOSHIBA
Quantity:
12 000
Company:
Part Number:
TLP621-2(GB,F,T)
Manufacturer:
Toshiba
Quantity:
468
Company:
Part Number:
TLP621-2GBF
Manufacturer:
TOSHIBA
Quantity:
1 000
Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC