HYS64T128021HDL-3S-B Qimonda, HYS64T128021HDL-3S-B Datasheet

MODULE DDR2 1GB 200-SODIMM

HYS64T128021HDL-3S-B

Manufacturer Part Number
HYS64T128021HDL-3S-B
Description
MODULE DDR2 1GB 200-SODIMM
Manufacturer
Qimonda
Datasheet

Specifications of HYS64T128021HDL-3S-B

Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
333MHz
Package / Case
200-SODIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1026
October 2007
HYS64T32x00HDL–[25F/2.5/3/3S/3.7/5]–B
HYS64T64x20HDL–[25F/2.5/3/3S/3.7/5]–B
HYS64T128x21HDL–[25F/2.5/3/3S/3.7/5]–B
2 0 0 Pi n S m a l l - O u t l i n e d D D R 2 S D R A M s M o d u l e s
D D R 2 S D R A M
S O - D I M M S D R A M
R o H S C o m p l i a n t
I n t e r n e t D a t a S h e e t
Rev. 1.12

Related parts for HYS64T128021HDL-3S-B

HYS64T128021HDL-3S-B Summary of contents

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HYS64T32x00HDL–[25F/2.5/3/3S/3.7/5]–B HYS64T64x20HDL–[25F/2.5/3/3S/3.7/5]–B HYS64T128x21HDL–[25F/2.5/3/3S/3.7/5]– ...

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... Added –25F Product Types; Added 6Layer –3S and –3.7 Product Types. 70, 71, 72 Updated Package Outline Drawings. Previous Revision: 2005-09, Rev 1.01 All Qimonda update 15 Modified AC Timing Parameters Previous Revision: 2005-06, Rev 1.0 We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document ...

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... Overview This chapter gives an overview of the 200-pin Small-Outline DDR2 SDRAM modules product family and describes its main characteristics. 1.1 Features • 200-Pin PC2-6400, PC2-5300, PC2-4200 and PC2-3200 DDR2 SDRAM memory modules. • 32M × 64, 64M × 64 and 128M × 64 module organization,and 32M × 16, 64M × 8 chip organization • ...

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... HYS64T64020HDL–3.7–B 512MB 2R×16 PC2–4200S–444–12–A0 HYS64T64920HDL–3.7–B 512MB 2R×16 PC2–4200S–444–12–A0 HYS64T128021HDL–3.7–B 1GB 2R×8 PC2–4200S–444–12–E0 HYS64T128921HDL–3.7–B 1GB 2R×8 PC2–4200S–444–12–E0 PC2-3200-333 HYS64T32000HDL– ...

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... Product Type DRAM Components HYS64T128021HDL HYB18T512800BF HYS64T128921HDL HYS64T64020HDL HYB18T512160BF HYS64T64920HDL HYS64T32000HDL HYB18T512160BF HYS64T32900HDL 1) Green Product 2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2 ...

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Pin Configurations 2.1 Pin Configurations The pin configuration of the Small Outline DDR2 SDRAM DIMM is listed by function in used in columns Pin Type and Buffer Type are explained in in Figure 1 Pin No. Name Clock Signals ...

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Pin No. Name 109 WE Address Signals 107 BA0 106 BA1 85 BA2 NC 102 A0 101 A1 100 105 A10 AP 90 A11 89 ...

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Pin No. Name 5 DQ0 7 DQ1 17 DQ2 19 DQ3 4 DQ4 6 DQ5 14 DQ6 16 DQ7 23 DQ8 25 DQ9 35 DQ10 37 DQ11 20 DQ12 22 DQ13 36 DQ14 38 DQ15 43 DQ16 45 DQ17 55 ...

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Pin No. Name 141 DQ40 143 DQ41 151 DQ42 153 DQ43 140 DQ44 142 DQ45 152 DQ46 154 DQ47 157 DQ48 159 DQ49 173 DQ50 175 DQ51 158 DQ52 160 DQ53 174 DQ54 176 DQ55 179 DQ56 181 DQ57 189 ...

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... EVENT The optional EVENT pin is reserved for use to flag critical module temperature and is used in conjunction with Thermal Sensor Not Connected Not connected on modules without temperature sensors. AI — I/O Reference Voltage Reference voltage for the SSTL-18 inputs. PWR — EEPROM Power Supply Power supplies for Serial Presence Detect, Thermal Sensor and ground for the module ...

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... DDR2 SDRAM mode register. Note: 2 Rank modules NC — Not Connected Note: 1 Rank modules NC — Not connected Pins not connected on Qimonda SO-DIMMs 11 Internet Data Sheet SO-DIMM DDR2 SDRAM Module TABLE 6 Abbreviations for pin Type TABLE 7 Abbreviations for Buffer Type ...

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Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module Pin Configuration SO-DIMM (200 pin) 12 Internet Data Sheet FIGURE 1 ...

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Electrical Characteristics 3.1 Absolute Maximum Ratings Attention: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any ...

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Symbol Parameter T Operating Temperature CASE 1) Operating Temperature is the case surface temperature on the center / top side of the DRAM. 2) The operating temperature range are the temperatures where all DRAM specification will be supported. During operation, ...

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Timing Characteristics 3.3.1 Speed Grade Definitions Speed Grade QAG Sort Name CAS-RCD-RP latencies Parameter Symbol t Clock Period @ ...

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The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS, input reference level is the crosspoint when in differential strobe mode V 3) ...

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... Exit precharge power-down to any valid command (other than NOP or Deselect) Exit self-refresh to a non-read command Exit self-refresh to read command Write command to DQS associated clock edges 1) For details and notes see the relevant Qimonda component data sheet 1.8 V ± 0.1V; = 1.8 V ± 0.1 V. DDQ DD 3) Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down and then restarted through the specified initialization sequence before normal operation can continue ...

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The input reference level (for timing reference CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS, input reference level is the crosspoint when in differential ...

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The pulse duration distortion of on-chip clock circuits, which represents how well the actual QHS transferred to the output; and 2) The worst case push-out of DQS on one transition followed by the worst case ...

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Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module Differential input waveform timing Differential input waveform timing 20 Internet Data Sheet FIGURE and DS DH FIGURE and lS lH ...

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DRAM Component Timing Parameter by Speed Grade - DDR2–533 and DDR2–400 Parameter Symbol t CAS A to CAS B command period CCD t CK, CK high-level width CH t CKE minimum high and low pulse CKE width t CK, CK ...

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Parameter Symbol t Address and control input setup time IS.BASE t DQ low-impedance time from CK / LZ(DQ DQS low-impedance from LZ(DQS) t MRS command to ODT update MOD delay t Mode register set command ...

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... Parameter Symbol t Exit Self-Refresh to Read command XSRD Write recovery time for write with WR Auto-Precharge 1) For details and notes see the relevant Qimonda component data sheet 1.8 V ± 0.1V; = 1.8 V ± 0.1 V. DDQ DD 3) Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down and then restarted through the specified initialization sequence before normal operation can continue ...

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ODT AC Electrical Characteristics This chapter describes the ODT AC electrical characteristics. ODT AC Characteristics and Operating Conditions for DDR2-667 & DDR2-800 Symbol Parameter / Condition t ODT turn-on delay AOND t ODT turn-on AON t ODT turn-on (Power-Down ...

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ODT turn off time min. is when the device starts to turn off ODT resistance. ODT turn off time max is when the bus is in high impedance. t Both are measured from . Both are measured from AOFD ...

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... Definitions for see Table For two rank modules: All active current measurements in the same Mode. 5) For details and notes see the relevant Qimonda component data sheet and current measurements are defined with the outputs disabled ( DD1 ...

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Product Type Organization 256 MB 512 MB 1 Rank 2 Ranks (×16) (×16) ×64 ×64 –25F –25F Symbol Max. Max. I 420 448 DD0 I 480 508 DD1 DD2P I 205 410 DD2N I 180 360 DD2Q ...

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Product Type Organization 256 MB 512 MB 1 Rank 2 Ranks (×16) (×16) ×64 ×64 –3 –3 Symbol Max. Max. I 380 410 DD0 I 420 450 DD1 DD2P I 180 360 DD2N I 160 320 DD2Q ...

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Product Type Organization 256 MB 1 Rank (×16) ×64 –3.7 Symbol Max. I 320 DD0 I 360 DD1 I 30 DD2P I 150 DD2N I 140 DD2Q I 110 DD3P( MRS = DD3P( MRS = 1) I ...

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SPD Codes This chapter lists all hexadecimal byte values stored in the EEPROM of the products described in this data sheet. SPD stands for serial presence detect. All values with XX in the table are module specific bytes which ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 10 SDRAM @ CL (Byte 18) [ns] AC MAX 11 Error Correction Support (non-ECC, ECC) 12 Refresh Rate and Type ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description t 35 [ns] DH.MIN t 36 [ns] WR.MIN t 37 [ns] WTR.MIN t 38 [ns] RTP.MIN 39 Analysis Characteristics and Extension RC RFC t 41 [ns] RC.MIN ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DTREG) / Toggle Rate REG 62 SPD Revision 63 Checksum of Bytes 0-62 64 Manufacturer’s JEDEC ID Code (1) 65 Manufacturer’s JEDEC ID Code (2) 66 Manufacturer’s ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 87 Product Type, Char 15 88 Product Type, Char 16 89 Product Type, Char 17 90 Product Type, Char 18 91 Module Revision Code 92 Test Program Revision Code 93 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t 26 SDRAM @ CL -2 [ns] AC MAX t 27 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) 3P.fast ∆ (DT3P ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 81 Product Type, Char 9 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t 26 SDRAM @ CL -2 [ns] AC MAX t 27 ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) 3P.fast ∆ (DT3P ...

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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 81 Product Type, Char 9 ...

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Package Outlines Notes 1. Thermal Sensor (Optional) 2. SPD or Combidevice (if used then no Thermal Sensor needed) Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module Package Outline Raw Card C L-DIM-200-30 63 Internet Data Sheet FIGURE 5 ...

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Notes 1. Thermal Sensor (Optional) 2. SPD or Combidevice (if used then no Thermal Sensor needed) Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module Package Outline Raw Card A L-DIM-200-31 64 Internet Data Sheet FIGURE 6 ...

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Notes 1. SPD or Combidevice (if used then no Thermal Sensor needed) 2. Thermal Sensor (Optional) Rev. 1.12, 2007-10 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module Package Outline Raw Card E L-DIM-200-36 65 Internet Data Sheet FIGURE 7 ...

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... Product Type Nomenclature Qimonda’s nomenclature uses simple coding combined with some proprietary coding. Table 31 provides examples for module and component product type number as well as the Example for Field Number 1 2 Micro-DIMM HYS 64 DDR2 DRAM HYB 18 Field Description 1 Qimonda Module Prefix ...

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... Multiplying “Memory Density per I/O” with “Module Data Width” and dividing by 8 for Non-ECC and 9 for ECC modules gives the overall module memory density in MBytes as listed in column “Coding”. Field Description 1 Qimonda Component Prefix 2 Interface Voltage [V] 3 DRAM Technology ...

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Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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... Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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