HYS72T128000HR-3S-B Qimonda, HYS72T128000HR-3S-B Datasheet - Page 23
![MODULE DDR2 1GB 240-DIMM](/photos/7/83/78365/hys72t128000hr-3s-b_boardback_sml.jpg)
HYS72T128000HR-3S-B
Manufacturer Part Number
HYS72T128000HR-3S-B
Description
MODULE DDR2 1GB 240-DIMM
Manufacturer
Qimonda
Datasheet
1.HYS72T128000HR-3S-B.pdf
(52 pages)
Specifications of HYS72T128000HR-3S-B
Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
333MHz
Package / Case
240-DIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1028
13) The
14) The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range between 85 °C
15) 0 °C≤
16) 85 °C <
17) A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.
18) The
19) The maximum limit for the
20) Minimum
21) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard active power-
22) WR must be programmed to fulfill the minimum requirement for the
Rev. 1.2, 2007-01
03292006-JXZQ-CG6T
Parameter
DQ output access time from CK / CK
CAS A to CAS B command period
CK, CK high-level width
CKE minimum high and low pulse width
CK, CK low-level width
Auto-Precharge write recovery + precharge
time
Minimum time clocks remain ON after CKE
asynchronously drops LOW
DQ and DM input hold time (differential data
strobe)
DQ and DM input hold time (single ended data
strobe)
DQ and DM input pulse width (each input)
DQS output access time from CK / CK
DQS input low (high) pulse width (write cycle)
DQS-DQ skew (for DQS & associated DQ
signals)
Write command to 1st DQS latching transition
DQ and DM input setup time (differential data
strobe)
DQ and DM input setup time (single ended
data strobe)
(
parameters are verified by design and characterization, but not subject to production test.
and 95 °C.
Compliant Products” on Page
performance (bus turnaround) degrades accordingly.
down mode” (MR, A12 = “0”) a fast power-down exit timing
power-down exit timing
up to the next integer value.
refers to the application clock period. WR refers to the WR parameter stored in the MRS.
t
HZ,
t
t
t
HZ
RPST
RRD
T
,
CASE
T
t
RPST
), or begins driving (
timing parameter depends on the page size of the DRAM organization. See
CASE
t
WTR
≤ 85 °C
and
≤ 95 °C
is two clocks when operating the DDR2-SDRAM at frequencies ≤ 200 ΜΗz.
t
LZ
,
t
RPRE
t
XARDS
t
parameters are referenced to a specific voltage level, which specify when the device output is no longer driving
WPST
t
t
DAL
LZ,
has to be satisfied.
t
parameter is not a device limit. The device operates with a greater value for this parameter, but system
4.
= WR + (
RPRE
).
t
HZ
t
RP
and
/
t
CK
t
DRAM Component Timing Parameter by Speed Grade - DDR2-400
LZ
). For each of the terms, if not already an integer, round to the next highest integer.
transitions occur in the same access time windows as valid data transitions.These
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AC
CCD
CH
CKE
CL
DAL
DELAY
DH
DH1
DIPW
DQSCK
DQSL,H
DQSQ
DQSS
DS
DS1
(base)
(base)
(base)
(base)
t
XARD
23
can be used. In “low active power-down mode” (MR, A12 =”1”) a slow
t
WR
DDR2–400
–600
2
0.45
3
0.45
WR +
t
275
–25
0.35
–500
0.35
—
– 0.25
150
–25
Min.
IS
timing parameter, where
+
t
CK
t
RP
+
t
IH
HYS72T[64/128/256]xxxHR–[3S/3.7/5]–B
Table 2 “Ordering Information for RoHS
Max.
+600
—
0.55
—
0.55
—
––
––
—
—
+500
—
350
+ 0.25
—
—
240-Pin Registered DDR2 SDRAM
WR
MIN
[cycles] =
Unit
ps
t
t
t
t
t
ns
ps
ps
t
ps
t
ps
t
ps
ps
Internet Data Sheet
CK
CK
CK
CK
CK
CK
CK
CK
t
WR
(ns)/
TABLE 15
t
CK
Note
6)7)
—
—
—
—
—
8)21)
9)
10)
11)
—
—
—
11)
—
11)
11)
(ns) rounded
1)2)3)4)5)
t
CK