HYS72T128420HFA-3S-B Qimonda, HYS72T128420HFA-3S-B Datasheet - Page 3
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HYS72T128420HFA-3S-B
Manufacturer Part Number
HYS72T128420HFA-3S-B
Description
MODULE DDR2 1GB 240-DIMM
Manufacturer
Qimonda
Datasheet
1.HYS72T128420HFA-3S-B.pdf
(44 pages)
Specifications of HYS72T128420HFA-3S-B
Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
333MHz
Package / Case
240-DIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1030
1
This chapter describes the main characteristics of the 240-Pin Fully-Buffered DDR2 SDRAM Modules product family.
1.1
• 240-pin Fully-Buffered ECC Dual-In-Line
• Module organisation one rank 64M x 72,
• JEDEC Standard Double Data Rate 2
• Built with 512Mb DDR2 SDRAMs in 60-ball FBGA
• Re-drive and re-sync of all address, command, clock and
• High-Speed Differential Point-to-Point Link Interface at 1.5
• Host Interface and AMB component industry standard
• Supports SMBus protocol interface for access to the AMB
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
Rev. 1.00, 2006-10
10062006-RQWY-GI6S
Product Type Speed Code
Speed Grade
max. Clock Frequency
min. RAS-CAS-Delay
min. Row Precharge Time
min. Row Active Time
min. Row Cycle Time
DDR2 SDRAM Module for PC, Workstation and Server
main memory applications.
one rank 128M x 72, two ranks 128M x 72,
two ranks 256M x 72
Synchronous DRAMs (DDR2 SDRAMs) with 1.8 V
(± 0.1 V) power supply.
Chipsize Packages.
data signals using AMB (Advanced Memory Buffer).
V (Jedec standard pending).
compliant.
configuration registers.
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Overview
Features
@CL5
@CL4
@CL3
f
f
f
t
t
t
t
CK5
CK4
CK3
RCD
RP
RAS
RC
–3S
PC2–5300 5–5–5
333
266
200
15
15
45
60
3
• Detects errors on the channel and reports them to the host
• Automatic DDR2 DRAM Bus Calibration.
• Automatic Channel Calibration.
• Full Host Control of the DDR2 DRAMs.
• Over-Temperature Detection and Alert.
• Hot Add-on and Hot Remove Capability.
• MBIST and IBIST Test Functions.
• Transparent Mode for DRAM Test Support.
• Low profile: 133.35mm x 30.35 mm
• 240 Pin gold plated card connector with 1.00mm contact
• Based on JEDEC standard reference card designs (Jedec
• SPD (Serial Presence Detect) with 256 Byte serial
• RoHS Compliant Products
memory controller.
centers (JEDEC standard pending).
standard pending).
E
2
PROM.Performance:
Performance for DDR2–667 and DDR2–533
HYS72T[64/128/256]4[00/20]HFA–[3S/3.7]–B
–3.7
PC2–4200 4–4–4
266
266
200
15
15
45
60
1)
Internet Data Sheet
TABLE 1
Unit
—
MHz
MHz
MHz
ns
ns
ns
ns