HSMD-C170 Avago Technologies US Inc., HSMD-C170 Datasheet

HSMD-C170

Manufacturer Part Number

HSMD-C170

Description

LED CHIP GAP ORANGE TOP MOUNT

Manufacturer

Avago Technologies US Inc.

Type

Uni-Colorr

Datasheets

1.HSMG-C197.pdf (12 pages)

2.HSMD-C170.pdf (9 pages)

Specifications of HSMD-C170

Package / Case

0805 (2012 Metric)

Viewing Angle

170°

Color

Orange

Millicandela Rating

8mcd

Current - Test

20mA

Wavelength - Dominant

604nm

Wavelength - Peak

605nm

Voltage - Forward (vf) Typ

2.2V

Lens Type

Diffused

Lens Style/size

Rectangle, 1.4mm x 1.25mm

Size / Dimension

2.00mm L x 1.25mm W

Height

0.80mm

Mounting Type

Surface Mount

Resistance Tolerance

604nm

Led Size

0805

Illumination Color

Orange

Lens Color/style

Diffused

Operating Voltage

2.2 V

Wavelength

604 nm

Luminous Intensity

8 mcd

Mounting Style

SMD/SMT

Package Type

Chip Led

Emitting Color

Orange

Test Current (it)

20mA

Forward Current

25mA

Dominant Wave Length

604nm

Forward Voltage

2.6V

Product Length (mm)

2mm

Product Height (mm)

0.8mm

Product Depth (mm)

1.25mm

Mounting

Surface Mount

Peak Wavelength

605nm

Shape Type

Rectangular

Chip Material

GaP

Main Category

Chip LED

Number Of Elements

Pin Count

Operating Temperature Classification

Industrial

Operating Temp Range

-40C to 85C

Reverse Voltage

Power Dissipation

52mW

Lens Dimensions

1.4x1.25x0.5mm

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Luminous Flux @ Current - Test

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

516-1794-2
HSMD-C170

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

HSMD-C170

Manufacturer:

AVAGO/安华高

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

HSMD-C170DG

Manufacturer:

LITEON

Quantity:

24 000

Current page: 1 of 9
Download datasheet (145Kb)

Description

These chip-type LEDs utilize Aluminum Indium Gallium

Phosphide (AlInGaP) material technology. The AlInGaP

material has a very high luminous efficiency, capable of

producing high light output over a wide range of drive

currents. The available colors in this surface mount series

are 592 nm Amber, 605 nm Orange, 626/631 nm Red for

AS AlInGaP.

All packages are binned by both color and intensity, ex-

cept for red color.

These ChipLEDs come either in two top emitting pack-

ages (HSMx-C170/C190/C191/C150) or in a side emitting

package (HSMx-C110). The right angle ChipLEDs are suit-

able for applications such as LCD backlighting. The top

emitting ChipLEDs with wide viewing angle are suitable

for light piping and direct backlighting of keypads and

panels. In order to facilitate pick and place operation,

these ChipLEDs are shipped in tape and reel, with 4000

units per reel for HSMx-C170/C190/C191 and 3000 units

per reel for HSMx-C110/C150.

These packages are compatible with IR soldering proc-

ess.

HSMx-C110/C170/C190/C191/C150

High Performance ChipLED

Data Sheet

HSMA-C110/C170/C190/C191/C150

HSML-C110/C170/C190/C191/C150

HSMC-C110/C170/C190/C191/C150

HSMZ-C110/C170/C190

per JESD22-A114C.01. Please observe appropriate precautions during handling and processing.

Refer to Application Note AN-1142 for additional details.

: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A ESD sensitive

Features

x High brightness AlInGaP material

x Small size

x Industry standard footprint

x Diffused optics

x Top emitting or right angle emitting

x Available in 3 colors (red, orange, amber)

x Compatible with IR soldering

x Available in 8 mm tape on 7" diameter reel

x Reel sealed in zip locked moisture barrier bags

Applications

x LCD backlighting

x Push button backlighting

x Front panel indicator

x Symbol indicator

x Microdisplays

x Small message panel signage

Related parts for HSMD-C170

HSMD-C170 Summary of contents

Page 1

HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide ...

Page 2

Package Dimensions LED DIE 2.6 (0.102 ) 3.2 (0.126 ) CLEAR EPOXY PC BOARD 1.6 (0.063 ) 3.2 (0.126 ) 3.2 (0.126 ) 0.9 (0.035) SOLDERING TERMINAL HSMx-C110 1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.3 ...

Page 3

Package Dimensions, continued 3.2 (0.126 ) DIFFUSED 2.0 (0.079) EPOXY 0.6 (0.024) PC BOARD CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) SOLDERING TERMINAL HSMx-C150 Device Selection Guide Footprint AS AlInGaP [1,2] (mm) Amber 1.6 x 0.8 x 0.8 HSMA-C190 ...

Page 4

Electrical Characteristics T = 25°C A Forward Voltage V (Volts Parameter Number Typ. Max. HSMA-C110 1.9 2.4 HSML-C110 1.9 2.4 HSMC-C110 1.9 2.4 HSMZ-C110 2.2 2.8 HSMA-C170/190/191/150 1.9 2.4 HSML-C170/190/191/150 1.9 2.4 HSMC-C170/190/191/150 ...

Page 5

Color Bin Limits [1] Orange Color Bins Dom. Wavelength (nm) Bin ID Min. A 597.0 B 600.0 C 603.0 D 606.0 E 609.0 F 612.0 Tolerance: ± 1 nm. Red Color Bins [1] Dom. Wavelength (nm) Bin ID Min. ...

Page 6

AS AlInGaP AMBER AS AlInGaP ORANGE 0.5 0 500 550 Figure 1. Relative intensity vs. wavelength. 100 AS AlInGaP 10 AS AlInGaP 1 (HSMZ-Cxxx only) 0.1 1.5 1.7 1.9 2.1 2.3 2.5 V – FORWARD VOLTAGE – ...

Page 7

ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. ...

Page 8

USER FEED DIRECTION PRINTED LABEL Figure 13. Reeling orientation. 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 8 CATHODE SIDE ...

Page 9

DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) HSMx-C110 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) Figure 15. Tape dimensions. END ...

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