HLMP-S501 Avago Technologies US Inc., HLMP-S501 Datasheet
HLMP-S501
Specifications of HLMP-S501
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HLMP-S501 Summary of contents
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... HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501, HLMP-S600 Rectangular LED Lamps Data Sheet Description The HLMP-S100, -S201, -5301, -S400, -S401, -S501, -S600 are epoxy encapsulated lamps in rectangu- lar packages which are easily stacked in arrays or used for discrete front panel indicators. Contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process ...
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... HLMP-S400 HLMP-S401 Yellow HLMP-S301 HLMP-S301-B00xx HLMP-S301-C00xx HLMP-S301-CDBxx Green HLMP-S501 HLMP-S501-C00xx HLMP-S501-D00xx HLMP-S501-DE0xx [1] Emerald Green HLMP-S600-A00xx Note: 1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation. Part Numbering System HLMP - Luminous Intensity Iv (mcd Min. 3.4 2 ...
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... Radiant intensity watts/steradian, may be found from the equation I e luminous efficacy in lumens/watt. 4. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation. 3 Device HLMP- Min. Typ. All 110 AlGaAs Red 645 High Efficiency Red ...
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Absolute Maximum Ratings 25°C A Parameter Peak Forward Current [1] Average Forward Current DC Current [2] [3] Transient Forward Current (10 µsec Pulse) LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. See Figure 5 ...
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AlGaAs RED RED 50 YELLOW GREEN/EMERALD GREEN 10 0 1.0 2.0 3.0 4.0 5.0 V – FORWARD VOLTAGE – Figure 2. Forward current vs. forward voltage characteristics. V (300 mA) for ...
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Intensity Bin Limits Intensity Range (mcd) Color Bin Min. D 2.4 E 3.8 F 6.1 G 9.7 H 15.5 I 24.8 J 39.6 K 63.4 L 101.5 M 162.4 N 234.6 Red/Orange O 340.0 P 540.0 Q 850.0 R 1200.0 ...
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Color Categories Color Category # 9 Emerald Green Green Yellow Orange Tolerance for each bin limit is ±0.5 nm. ...
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Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any ...