LG T67K-H2K1-24-Z OSRAM Opto Semiconductors Inc, LG T67K-H2K1-24-Z Datasheet - Page 10

• Manufacturer Part Number: LG T67K-H2K1-24-Z
• Description: LED TOPLED GRN 570NM CLR 2-PLCC
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LG T67K-H2K1-24-Z

• Package / Case: 2-PLCC
• Viewing Angle: 120°
• Color: Green
• Luminous Flux @ Current - Test: 19 mlm
• Millicandela Rating: 6.28mcd
• Current - Test: 2mA
• Wavelength - Dominant: 570nm
• Wavelength - Peak: 572nm
• Voltage - Forward (vf) Typ: 1.8V
• Lens Type: Clear
• Lens Style/size: Round, 2.4mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 2.10mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 570nm
• Led Size: 2.4 mm X 2.4 mm X 0.9 mm
• Illumination Color: Green
• Operating Voltage: 2.2 V
• Wavelength: 570 nm
• Luminous Intensity: 9 mcd (Max)
• Mounting Style: SMD/SMT
• Operating Current: 20 mA
• Lens Shape: Circular
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 572 nm
• Package Type: PLCC
• Emitting Color: Yellow Green
• Test Current (it): 2mA
• Forward Current: 20mA
• Dominant Wave Length: 570nm
• Luminous Flux: 0.019lm
• Forward Voltage: 2.2V
• Product Length (mm): 3.4mm
• Product Height (mm): 2mm
• Product Depth (mm): 3mm
• Mounting: Surface Mount
• Shape Type: Circular
• Chip Material: AlGaInP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 12V
• Power Dissipation: 50mW
• Lens Dimensions: 2.4x2.4x0.9mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 475-2679-2; Q65110A2183

Empfohlenes Lötpaddesign
Recommended Solder Pad
Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Pad useable for TOPLED
IR Reflow Soldering
2004-12-02
8) Seite 15
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) page 15
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
8) 9) page 15
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) 9) Seite 15
0.7 (0.028)
0.8 (0.031)
2.6 (0.102)
Anode
3.3 (0.130)
IR-Reflow Löten
IR Reflow Soldering
Lötstoplack
Solder resist
10
®
and Power TOPLED
Lötstopplack
Solder resist
®
Cu Fläche / 16 mm per pad
Cu-area
2.6 (0.102)
und Power TOPLED
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
<
_
Cu-Fläche > 16 mm
Cu-area > 16 mm
2
OHLPY970
Kathode/
Cathode
2
®
2
LG T67K, LP T67K
®
OHLPY440