LG T670-L1M2-1-Z OSRAM Opto Semiconductors Inc, LG T670-L1M2-1-Z Datasheet - Page 11

LED TOPLED GREEN 570NM 2-PLCC

LG T670-L1M2-1-Z

Manufacturer Part Number
LG T670-L1M2-1-Z
Description
LED TOPLED GREEN 570NM 2-PLCC
Manufacturer
OSRAM Opto Semiconductors Inc
Series
TOPLEDr
Type
Uni-Colorr
Datasheets

Specifications of LG T670-L1M2-1-Z

Package / Case
2-PLCC
Viewing Angle
120°
Color
Green
Luminous Flux @ Current - Test
60 mlm
Millicandela Rating
19.6mcd
Current - Test
10mA
Wavelength - Dominant
570nm
Wavelength - Peak
572nm
Voltage - Forward (vf) Typ
2V
Lens Type
Clear
Lens Style/size
Round, 2.4mm
Size / Dimension
3.20mm L x 2.80mm W
Height
2.10mm
Mounting Type
Surface Mount
Resistance Tolerance
570nm
Led Size
3.2 mm x 2.8 mm
Illumination Color
Green
Lens Color/style
Colorless Non-Diffused
Operating Voltage
2 V
Wavelength
570 nm
Luminous Intensity
28 mcd
Mounting Style
SMD/SMT
Operating Current
10 mA
Lens Dimensions
2.4 mm
Lens Shape
Flat Round
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Peak Wavelength
572 nm
Package Type
PLCC
Emitting Color
Yellow Green
Test Current (it)
10mA
Forward Current
30mA
Dominant Wave Length
570nm
Luminous Flux
0.06lm
Forward Voltage
2.5V
Product Length (mm)
3.4mm
Product Height (mm)
2mm
Product Depth (mm)
3mm
Mounting
Surface Mount
Shape Type
Circular
Chip Material
GaAsP
Main Category
Chip LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
12V
Power Dissipation
95mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
475-2732-2
Q65110A2120
Lötbedingungen
Soldering Conditions
IR-Reflow Lötprofil für bleifreies Löten
IR Reflow Soldering Profile for lead free soldering
Wellenlöten (TTW)
TTW Soldering
2006-01-01
T
300
250
200
150
100
T
50
˚C
0
300
250
200
150
100
50
0
C
0
0
255 ˚C
240 ˚C
217 ˚C
25 ˚C
235 C
100
Ramp Up
3 K/s (max)
C
... 260
... 130
50
C
C
ca 200 K/s
1. Welle
1. wave
50
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
2 K/s
120 s max
100
10 s
Recommended Solder Profile
Zwangskühlung
forced cooling
LS T670, LO T670, LY T670, LG T670, LP T670
5 K/s
Maximum Solder Profile
Minimum Solder Profile
100
11
2. Welle
2. wave
150
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020B)
(acc. to J-STD-020B)
(nach CECC 00802)
(acc. to CECC 00802)
2 K/s
150
200
100 s max
30 s max
t
Normalkurve
standard curve
Grenzkurven
limit curves
200
Ramp Down
6 K/s (max)
10 s min
t
250
260 ˚C
245 ˚C
235 ˚C
s
OHLY0598
OHLA0687
s
+0 ˚C
-5 ˚C
+5 ˚C
-0 ˚C
±5 ˚C
250
300

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