LW E67C-T1V2-5K8L-1-Z OSRAM Opto Semiconductors Inc, LW E67C-T1V2-5K8L-1-Z Datasheet - Page 11

• Manufacturer Part Number: LW E67C-T1V2-5K8L-1-Z
• Description: LED WHITE DIFFUSED 4-PLCC SMD
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LW E67C-T1V2-5K8L-1-Z

• Package / Case: 4-PLCC
• Viewing Angle: 120°
• Color: White
• Luminous Flux @ Current - Test: 2.1 lm
• Millicandela Rating: 700mcd
• Current - Test: 30mA
• Wavelength - Dominant: 5600K
• Voltage - Forward (vf) Typ: 3.9V
• Lens Type: Diffused, Yellow Tinted
• Lens Style/size: Round, 2.4mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 2.10mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 5600K
• Led Size: 3.2 mm x 2.8 mm
• Illumination Color: White
• Lens Color/style: Colored Diffused
• Operating Voltage: 3.8 V
• Luminous Intensity: 1120 mcd
• Mounting Style: SMD/SMT
• Operating Current: 30 mA
• Color Temperature: 5600 K
• Lens Dimensions: 2.4 mm
• Lens Shape: Round
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Package Type: PLCC
• Emitting Color: White
• Test Current (it): 30mA
• Forward Current: 30mA
• Color Coordinates: 5600K
• Dominant Wave Length: Not Requirednm
• Luminous Flux: 2.1lm
• Forward Voltage: 4.35V
• Product Length (mm): 3mm
• Product Height (mm): 2mm
• Product Depth (mm): 3.4mm
• Mounting: Surface Mount
• Peak Wavelength: Not Requirednm
• Shape Type: Circular
• Chip Material: InGaN
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 4
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Wavelength - Peak: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 475-1187-2; Q65110A1932

Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Paduseable for TOPLED
IR Reflow Soldering
Empfohlenes Lötpaddesign
Recommended Solder Pad
2005-11-30
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) Seite 16
8) page 16
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
6.1 (0.240)
8) page 16
8) Seite 16
0.8 (0.031)
2.8 (0.110)
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
3.3 (0.130)
Lötstoplack
Solder resist
11
®
Anode
and Power TOPLED
2.8 (0.110)
Wellenlöten (TTW)
TTW Soldering
®
Cu Fläche / 16 mm per pad
Cu-area
und Power TOPLED
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.5 (0.020)
_
<
2
Cu Fläche / > 16 mm per pad
Cu-area
®
Kathode/
Cathode
Lötstoplack
Solder resist
Kathode/
Cathode
®
OHLPY440
2
OHAY1583
LW E67C