LW T67C-T2U2-5K8L-Z OSRAM Opto Semiconductors Inc, LW T67C-T2U2-5K8L-Z Datasheet - Page 11

• Manufacturer Part Number: LW T67C-T2U2-5K8L-Z
• Description: LED TOPLED WHITE 5600K 2PLCC SMD
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LW T67C-T2U2-5K8L-Z

• Package / Case: 2-PLCC
• Viewing Angle: 120°
• Color: White
• Luminous Flux @ Current - Test: 1.6 lm
• Millicandela Rating: 532.5mcd
• Current - Test: 20mA
• Wavelength - Dominant: 5600K
• Voltage - Forward (vf) Typ: 3.6V
• Lens Type: Diffused, Yellow Tinted
• Lens Style/size: Round, 2.4mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 2.10mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 5600K
• Led Size: 3.2 mm x 2.8 mm
• Illumination Color: White
• Lens Color/style: Colored Diffused
• Operating Voltage: 3.6 V
• Luminous Intensity: 710 mcd
• Mounting Style: SMD/SMT
• Operating Current: 20 mA
• Color Temperature: 5600 K
• Lens Dimensions: 2.4 mm
• Lens Shape: Round
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Package Type: PLCC
• Emitting Color: White
• Test Current (it): 20mA
• Forward Current: 20mA
• Color Coordinates: 5600K
• Dominant Wave Length: Not Requirednm
• Luminous Flux: 1.6lm
• Forward Voltage: 4.1V
• Product Length (mm): 3.4mm
• Product Height (mm): 2mm
• Product Depth (mm): 3mm
• Mounting: Surface Mount
• Peak Wavelength: Not Requirednm
• Shape Type: Circular
• Chip Material: InGaN
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Power Dissipation: 85mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Wavelength - Peak: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 475-2670-2; Q65110A1742

Empfohlenes Lötpaddesign
Recommended Solder Pad
Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Pad useable for TOPLED
IR Reflow Soldering
2005-10-19
8) Seite 16
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) page 16
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) 9) page 16
8) 9) Seite 16
0.7 (0.028)
0.8 (0.031)
2.6 (0.102)
Anode
3.3 (0.130)
Lötstoplack
Solder resist
11
®
Lötstopplack
Solder resist
and Power TOPLED
IR Reflow Löten
IR Reflow Soldering
®
Cu Fläche / 16 mm per pad
Cu-area
2.6 (0.102)
und Power TOPLED
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
_
<
Cu-Fläche > 16 mm
Cu-area > 16 mm
2
OHLPY970
Kathode/
Cathode
2
®
2
®
OHLPY440
LW T67C