SFT825N-S Seoul Semiconductor Inc, SFT825N-S Datasheet - Page 16

• Manufacturer Part Number: SFT825N-S
• Description: LWS RED/GRN/BLUE DIFF LENS 6PLCC
• Manufacturer: Seoul Semiconductor Inc

Specifications of SFT825N-S

• Package / Case: 6-PLCC
• Viewing Angle: 120°
• Color: Red, Green, Blue (RGB)
• Luminous Flux @ Current - Test: 1.7 lm Red, 2.8 lm Green, 0.93 lm Blue
• Millicandela Rating: 700mcd Red, 1200mcd Green, 400mcd Blue
• Current - Test: 3 x 20mA
• Wavelength - Dominant: 623nm, 527nm, 460nm
• Wavelength - Peak: 632nm, 518nm, 453nm
• Voltage - Forward (vf) Typ: 2.1V Red, 3.2V Green, 3.2V Blue
• Lens Type: Diffused, White
• Lens Style/size: Rectangle, 2.4mm x 2.1mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 1.40mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 623nm, 527nm, 460nm
• Illumination Color: Red, Green, Blue
• Lens Color/style: Diffused
• Operating Voltage: 2.1 V, 3.2 V, 3.2 V
• Wavelength: 623 nm, 527 nm, 460 nm
• Mounting Style: SMD/SMT
• Operating Current: 30 mA
• Lens Shape: Square
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 632 nm, 518 nm, 453 nm
• Wavelength/color Temperature: 623 nm, 527 nm, 460 nm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 897-1039-2

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
[°C]
Temp
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
(3) Hand Soldering conditions
(4) The encapsulated material of the LEDs is silicone.
encapsulated part.
affect the silicone resign should be used.
180
150
260
240
220
200
0
10. Soldering
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Precautions should be taken to avoid the strong pressure on the
So when using the chip mounter, the picking up nozzle that does not
Pre-heating
Rising
5 °C/sec
Document No. : SSC-QP-7-07-24 (Rev.00)
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
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[Hr]
Time
acriche
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June 2009
June 2009
Rev. 07
Rev. 07
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