HLMP-3316 Avago Technologies US Inc., HLMP-3316 Datasheet
HLMP-3316
Specifications of HLMP-3316
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HLMP-3316 Summary of contents
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... LED lamps is 4 specially designed for applications requiring higher on-axis intensity than is achievable with a standard lamp. The light generated is focused to a narrow beam to achieve this effect. Selection Guide Color Part Number Red HLMP-3316 HLMP-3316-I00xx HLMP-3416 Yellow HLMP-3416-G00xx HLMP-3416-IJ0xx Green HLMP-3519 HLMP-3519-F00xx Features • ...
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Part Numbering System Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B1: Right Angle Housing, Uneven Leads B2: Right Angle Housing, Even Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv ...
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... Rq Thermal Resistance J-PIN V Forward Voltage F V Reverse Breakdown Volt Luminous Efficacy V Notes the off-axis angle at which the luminous intensity is half the axial luminous intensity. 1/2 2. The dominant wavelength derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of d the device. 3. Radiant intensity watts/steradian, may be found from the equation I e luminous efficacy in lumens/watt. 3 Device HLMP- Min. Typ. Max. 3316 22 60.0 3416 14.7 50.0 3519 10.6 70.0 3316 35 3416 35 3519 24 331X 635 341X ...
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Absolute Maximum Ratings 25°C A Parameter Peak Forward Current [1] Average Forward Current DC Current [2] Power Dissipation [3] Reverse Voltage (I = 100 µA) R Transient Forward Current [4] (10 µsec Pulse) LED Junction Temperature Operating Temperature Range Storage Temperature Range N otes: 1. See Figure 5 (Red), 10 (Yellow (Green) to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maxi- mum Ratings. Figure 1. ...
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... High Efficiency Red HLMP-331X Series Figure 2. Forward current vs. forward voltage characteristics. Figure 5. Maximum tolerable peak current vs. pulse duration (I MAX as per MAX ratings Figure 3. Relative luminous intensity vs. DC forward current. Figure 6. Relative luminous intensity vs. angular displacement. Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. ...
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... Yellow HLMP-341X Series Figure 7. Forward current vs. forward voltage characteristics. Figure 10. Maximum tolerable peak current vs. pulse duration (I MAX as per MAX ratings Figure 8. Relative luminous intensity vs. DC forward current. Figure 11. Relative luminous intensity vs. angular displacement. Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current. ...
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... Green HLMP-351X Series Figure 12. Forward current vs. forward voltage characteristics. Figure 15. Maximum tolerable peak current vs. pulse duration (I MAX as per MAX ratings Figure 13. Relative luminous intensity vs. DC forward current. Figure 16. Relative luminous intensity vs. angular displacement. T-1 Figure 14. Relative efficiency (luminous inten- sity per unit current) vs. peak LED current. ...
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Table 2. Intensity Bin Limit Intensity Range (mcd) Color Bin Min. Max. H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 ...
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Color Categories Lambda (nm) Color Cat # Min. Max. 6 561.5 564.5 5 564.5 567.5 Green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 ...
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Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • recommended ...