HLMP-3590 Avago Technologies US Inc., HLMP-3590 Datasheet - Page 11

• Manufacturer Part Number: HLMP-3590
• Description: LED 5MM LOPRO 565NM GRN WTR CLR
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-3590

• Viewing Angle: 32°
• Color: Green
• Millicandela Rating: 55mcd
• Current - Test: 20mA
• Wavelength - Dominant: 569nm
• Wavelength - Peak: 565nm
• Voltage - Forward (vf) Typ: 2.2V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Package / Case: Radial - 2 Lead
• Height: 5.84mm
• Mounting Type: Through Hole
• Resistance Tolerance: 569nm
• Bulb Size: T-1 3/4 (5mm)
• Led Color: Green
• Luminous Intensity: 55mcd
• Forward Current If: 20mA
• Forward Voltage: 2.2V
• Led Mounting: Through Hole
• Lens Shape: Round
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1322

11
Example of Wave Soldering Temperature Profile for TH LED
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
(1P) Item: Part Number
(V) Vendor ID:
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
max temp 250C
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.