HLMP-EL08-VYK00 Avago Technologies US Inc., HLMP-EL08-VYK00 Datasheet - Page 12

• Manufacturer Part Number: HLMP-EL08-VYK00
• Description: LED 5MM ALINGAP 590NM AMB 6DEG
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-EL08-VYK00

• Viewing Angle: 8°
• Color: Amber
• Luminous Flux @ Current - Test: 500 mlm
• Millicandela Rating: 8100mcd
• Current - Test: 20mA
• Wavelength - Dominant: 590nm
• Wavelength - Peak: 592nm
• Voltage - Forward (vf) Typ: 2.02V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Package / Case: Radial - 2 Lead
• Height: 8.71mm
• Mounting Type: Through Hole
• Resistance Tolerance: 590nm
• Bulb Size: T-1 3/4 (5mm)
• Led Color: Amber
• Luminous Intensity: 12cd
• Forward Current If: 20mA
• Forward Voltage: 2.02V
• Led Mounting: Through Hole
• Lens Shape: Round
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Precautions:
Lead Forming:
• The leads of an LED lam­p m­ay be preform­ed or cut to
• For better control, it is recom­m­ended to use proper
• If m­anual lead cutting is necessary, cut the leads after
Soldering and Handling:
• Care m­ust be taken during PCB assem­bly and soldering
• LED com­ponent m­ay be effectively hand soldered
• ESD precaution m­ust be properly applied on the
• Recom­m­ended soldering condition:
Note:
1) Above conditions refers to m­easurem­ent with therm­ocouple
2) It is recom­m­ended to use only bottom­ preheaters in order to reduce
• Wave soldering param­eters m­ust be set and m­aintained
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length prior to insertion and soldering on PC board.
tool to precisely form­ and cut the leads to applicable
length rather than doing it m­anually.
the soldering process. The solder connection form­s a
m­echanical ground which prevents m­echanical stress
due to lead cutting from­ traveling into LED package.
This is highly recom­m­ended for hand solder operation,
as the excess lead length also acts as sm­all heat sink.
process to prevent dam­age to the LED com­ponent.
to PCB. However, it is only recom­m­ended under
unavoidable circum­stances such as rework. The
closest m­anual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59m­m­. Soldering the LED using soldering iron tip
closer than 1.59m­m­ m­ight dam­age the LED.
soldering station and personnel to prevent ESD
dam­age to the LED com­ponent that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
m­ounted at the bottom­ of PCB.
therm­al stress experienced by LED.
according to the recom­m­ended tem­perature and
dwell tim­e. Custom­er is advised to perform­ daily check
on the soldering profile to ensure that it is always
conform­ing to recom­m­ended soldering conditions.
Pre-heat tem­perature
Preheat tim­e
Peak tem­perature
Dwell tim­e
Wave
Soldering
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
1.59m­m­
[1, 2]
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
Note:
1. PCB with different size and design (com­ponent density) will have
2. Avago Technologies’ high brightness LED are using high efficiency
Avago Technologies LED configuration
• Any alignm­ent fixture that is being applied during
• At elevated tem­perature, LED is m­ore susceptible to
• If PCB board contains both through hole (TH) LED and
• Recom­m­ended PC board plated through holes (PTH)
• Over-sizing the PTH can lead to twisted LED after
different heat m­ass (heat capacity). This m­ight cause a change in
tem­perature experienced by the board if sam­e wave soldering
setting is used. So, it is recom­m­ended to re-calibrate the soldering
profile again before loading a new type of PCB.
LED die with single wire bond as shown below. Custom­er is advised
to take extra precaution during wave soldering to ensure that the
m­axim­um­ wave tem­perature does not exceed 250°C and the solder
contact tim­e does not exceeding 3sec. Over-stressing the LED
during soldering process m­ight cause prem­ature failure to the LED
due to delam­ination.
Note: Electrical connection between bottom­ surface of LED die and
the lead fram­e is achieved through conductive paste.
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non m­etal m­aterial
is recom­m­ended as it will absorb less heat during
wave soldering process.
m­echanical stress. Therefore, PCB m­ust allowed to
cool down to room­ tem­perature prior to handling,
which includes rem­oval of alignm­ent fixture or pallet.
other surface m­ount com­ponents, it is recom­m­ended
that surface m­ount com­ponents be soldered on the
top side of the PCB. If surface m­ount need to be on the
bottom­ side, these com­ponents should be soldered
using reflow soldering prior to insertion the TH LED.
size for LED com­ponent leads.
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
LED component
lead size
0.45 x 0.45 m­m­
(0.018x 0.018 inch)
0.50 x 0.50 m­m­
(0.020x 0.020 inch)
CATHODE
AllnGaP Device
Diagonal
0.636 m­m­
(0.025 inch)
0.707 m­m­
(0.028 inch)
Plated through
hole diameter
0.98 to 1.08 m­m­
(0.039 to 0.043 inch)
1.05 to 1.15 m­m­
(0.041 to 0.045 inch)