B32674D3475K EPCOS Inc, B32674D3475K Datasheet - Page 24
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B32674D3475K
Manufacturer Part Number
B32674D3475K
Description
CAP 4.7UF 10% 300V METAL POLYPRO
Manufacturer
EPCOS Inc
Series
MKP B32674r
Datasheet
1.B32674D8474K.pdf
(32 pages)
Specifications of B32674D3475K
Capacitance
4.7µF
Tolerance
±10%
Lead Spacing
1.083" (27.50mm)
Voltage - Ac
160V
Voltage - Dc
300V
Dielectric Material
Polypropylene, Metallized
Esr (equivalent Series Resistance)
4.1 mOhm
Operating Temperature
-40°C ~ 105°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.240" L x 0.551" W (31.50mm x 14.00mm)
Height
0.965" (24.50mm)
Termination
PC Pins
Features
AC and Pulse
Voltage Rating
300 Volts
Esr
7 mOhms
Termination Style
Radial
Dimensions
14 mm W x 31.5 mm L x 24.5 mm H
Operating Temperature Range
- 55 C to + 85 C
Product
Metallized Polypropylene Capacitors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
495-2910
B32674D3475K000
B32674D3475K000
1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32674 ... B32678
MKP DC link
max
. Long exposure to temperatures above this type-related temperature limit
high power series
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