HLMP-CW30-PS000 Avago Technologies US Inc., HLMP-CW30-PS000 Datasheet - Page 10

LED 5MM WHT WTR CLR W/O STANDOFF

HLMP-CW30-PS000

Manufacturer Part Number
HLMP-CW30-PS000
Description
LED 5MM WHT WTR CLR W/O STANDOFF
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HLMP-CW30-PS000

Viewing Angle
30°
Color
White
Millicandela Rating
1690mcd
Current - Test
20mA
Wavelength - Dominant
6200K
Voltage - Forward (vf) Typ
3.2V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Package / Case
Radial - 2 Lead
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
6200K
Bulb Size
T-1 3/4 (5mm)
Led Color
White
Luminous Intensity
2.5cd
Forward Current If
20mA
Forward Voltage
3.2V
Led Mounting
Through Hole
Lens Shape
Round
Lead Spacing
2.54mm
Led Gas Type
InGaN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Wavelength - Peak
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1469

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-CW30-PS000
Manufacturer:
AVAGO
Quantity:
40 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
(0.7087 ± 0.0197)
Note: The ammopacks drawing is applicable to option -DD & -ZZ and regardless of standoff or non standoff.
10
18.00 ± 0.50
250
200
150
100
50
ALL DIMENSIONS IN MILLIMETERS (INCHES).
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
(0.50 ± 0.0118)
12.70 ± 0.30
TURBULENT WAVE
40
(0.50 ± 0.0394)
12.70 ± 1.00
TIME (MINUTES)
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
CATHODE
A
70
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
(0.1575 ± 0.008)
4.00 ± 0.20
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
(0.807 ± 0.039)
TYP.
20.50 ± 1.00

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