HLMP-CM12-Y20DD Avago Technologies US Inc., HLMP-CM12-Y20DD Datasheet - Page 9

• Manufacturer Part Number: HLMP-CM12-Y20DD
• Description: LED 5MM INGAN 525NM GREEN 15DEG
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-CM12-Y20DD

• Color: Green
• Millicandela Rating: 18150mcd
• Current - Test: 20mA
• Wavelength - Dominant: 525nm
• Wavelength - Peak: 516nm
• Voltage - Forward (vf) Typ: 3.3V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Package / Case: Radial - 2 Lead
• Height: 8.61mm
• Viewing Angle: 15°
• Mounting Type: Through Hole
• Resistance Tolerance: 525nm
• Led Size: T-1 3/4
• Illumination Color: Green
• Lens Color/style: Clear
• Wavelength: 521 nm
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Details

Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• For better control, it is recommended to use proper
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest manual soldering distance of the soldering
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
Notes:
9
length prior to insertion and soldering on PC board.
be taken to avoid any excessive mechanical stress in-
duced into the LED package. Otherwise, cut the leads
to applicable length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress, due to lead cutting, from traveling
to the LED chip die attach and wirebond.
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
process to prevent damage to LED component.
heat source (soldering iron’s tip) to the body is
1.59 mm. Soldering the LED closer than 1.59 mm might
damage the LED.
Pre-heat Temperature 105 °C Max.
Pre-heat Time
Peak Temperature
Dwell Time
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile is always conforming to recommended
soldering condition.
1. PCB with different size and design (component density) will have different heat
mass (heat capacity). This might cause a change in temperature experienced by the
board if samewave soldering setting is used. So, it is recommended to recalibrate
the soldering profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single
wire bond, as shown below. Customer is advised to take extra precaution during
wave soldering to ensure that the maximum wave temperature does not exceed 250°C.
Over-stressing the LED during soldering process might cause premature failure to the
LED due to delamination.
1.59 mm
Wave Soldering Dipping
0 sec Max.
50 °C Max.
 sec Max.
Manual Solder
–
–
60 °C Max.
5 sec Max.
• If necessary, use fixture to hold the LED component
• At elevated temperature, the LED is more susceptible
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
• Over sizing of plated through hole can lead to
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die and the lead frame material
through conductive paste of solder.
in proper orientation with respect to the PCB during
soldering process.
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED component leads:
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.00 x 0.00 inch)
Note: Refer to application note AN1027 for more information on soldering LED
components.
ANODE
InGaN Device
Diagonal
0.646 mm
(0.05 inch)
0.718 mm
(0.08 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.08 to 0.04 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)