HLMP-3750-L00B2 Avago Technologies US Inc., HLMP-3750-L00B2 Datasheet - Page 11
![LED 5MM GAP RED RT ANGLE HOUSING](/photos/15/75/157573/5989-4254en_sml.jpg)
HLMP-3750-L00B2
Manufacturer Part Number
HLMP-3750-L00B2
Description
LED 5MM GAP RED RT ANGLE HOUSING
Manufacturer
Avago Technologies US Inc.
Series
HLMP-3750r
Datasheet
1.HLMP-1340.pdf
(12 pages)
Specifications of HLMP-3750-L00B2
Color
Red
Voltage Rating
1.9V
Current
20mA
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Configuration
Single
Mounting Type
Through Hole, Right Angle
Led Size
T-1 3/4
Illumination Color
Red
Lens Color/style
Non-Diffused
Operating Voltage
1.9 V
Wavelength
626 nm
Luminous Intensity
125 mcd
Operating Current
25 mA
Lens Dimensions
5 mm
Lens Shape
Dome
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Viewing Angle
24 deg
Package / Case
T-1 3/4
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-3750-L00B2
Manufacturer:
AVAGO
Quantity:
40 000
Company:
Part Number:
HLMP-3750-L00B2
Manufacturer:
AVAGO
Quantity:
50 000
11
Example of Wave Soldering Temperature Profile for TH LED
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
(1P) Item: Part Number
(V) Vendor ID:
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
max temp 250C
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.