HLMP-4000#010 Avago Technologies US Inc., HLMP-4000#010 Datasheet - Page 6

• Manufacturer Part Number: HLMP-4000#010
• Description: LED 5MM HER/GRN RT ANGLE HOUSING
• Manufacturer: Avago Technologies US Inc.
• Series: HLMP-40xxr

Specifications of HLMP-4000#010

• Color: Green, Red
• Voltage Rating: 2.2V Green, 1.9V Red
• Current: 20mA
• Lens Type: Diffused, White
• Lens Style/size: Round, 5mm, T-1 3/4
• Configuration: Single
• Mounting Type: Through Hole, Right Angle
• Led Size: T-1 3/4
• Illumination Color: Greeed
• Lens Color/style: Diffused
• Operating Voltage: 2.2 V, 1.9 V
• Wavelength: 570 nm/626 nm
• Luminous Intensity: 4.2 mcd (Min) or 2.1 mcd (Min)
• Operating Current: 10 mA
• Lens Dimensions: 5.08 mm X 5.08 mm X 8.3 mm
• Lens Shape: Circular
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: Through Hole
• Viewing Angle: 65 deg
• Package / Case: T-1 3/4
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely
Soldering Conditions
• Care must be taken during PCB assembly and
• The closest LED is allowed to solder on board is 1.59
• Recommended soldering conditions:
Figure 8. Recommended wave soldering profile.
6
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
form and cut the leads to length rather than rely upon
hand operation.
soldering process to prevent damage to LED
component.
mm below the body (encapsulant epoxy) for those
parts without standoff.
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
250
200
150
100
50
30
0
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
105 C Max.
30 sec Max.
250 C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
90
Manual Solder
Dipping
–
–
260 C Max.
5 sec Max.
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
• Wave soldering parameter must be set and
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
Note: Refer to application note AN1027 for more
information on soldering LED components.
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
in proper orientation with respect to the PCB during
soldering process.
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25 C, before handling.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)