ST32TB201 Vishay, ST32TB201 Datasheet - Page 4
![TRIM POT ST-32TB 200 OHMS](/photos/8/52/85266/st-32_tb__sml.jpg)
ST32TB201
Manufacturer Part Number
ST32TB201
Description
TRIM POT ST-32TB 200 OHMS
Manufacturer
Vishay
Series
ST-32r
Datasheet
1.ST32TA204.pdf
(7 pages)
Specifications of ST32TB201
Resistance (ohms)
200
Power (watts)
0.125W, 1/8W
Taper
Linear
Tolerance
±20%
Temperature Coefficient
±100ppm/°C
Number Of Turns
Single
Adjustment Type
Top Adjustment
Mounting Type
Surface Mount
Resistive Material
Cermet
Package / Case
Square - 0.134" L x 0.134" W x 0.079" H (3.40mm x 3.40mm x 2.00mm)
Resistance In Ohms
200
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
RST32ETB201TR
ST32TB201TR
ST32TB201TR
Document Number: 58009
Revision: 06-Mar-06
MECHANICAL SPECIFICATIONS
Mechanical turn
Operating torque
Stop Strength
Rotational life
Thrust to rotor
Solderability
Shear (Adhesion)
Substrate bending Width 90 mm, bend 3 mm, 5 s, 1 time
Pull-off strength
ELECTRICAL CHARACTERISTICS
Nominal resistance
range
Resistance tolerance
Power ratings
Resistance law
Maximum input
voltage
Maximum wiper
current
Effective electrical
angle
End resistance
C.R.V.
Operating temp. range
Temp. coefficient
Insulation resistance
Dielectric strength
Net weight
Reflow profile for soldering heat evaluation
250
200
150
100
(°C)
50
180°C
150°C
250 ° (1 turn)
5 mN m {51 gf cm} maximum
20 mN m {204 gf cm} minimum
100 cycles
[ΔR/R ≤ ± (2 Ω + 3 %)]
5 N {0.51 kgf} minimum
Sn-Pb: 235 °C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ± 3 °C, 2 ∼ 3 s
5 N {0.51 kgf} 10 s
5 N {0.51 kgf} 10 s
100 Ω ∼ 2 MΩ: ± 100 10
Pre Heating Zone
DC200 V or power rating, whichever is
Peak : 250
10 Ω ∼ 50 Ω: ± 250 10
100 mA or power rating, whichever is
Reflow : two times maximum
Approx. 0.11 g (ST-32G, H, EG, EH)
Heating time
Approx. 0.05 g (ST-32A, B, EA, EB)
Over 230 °C
1 % or 2 Ω, whichever is greater
1 % or 3 Ω, whichever is greater
90 ± 30 s
1000 MΩ minimum (DC500 V)
0.125 W (70 °C) 0 W (125 °C)
Surface Mount Cermet Trimmers (single turn)
30 ± 10 s
+5
0
°C
AC500 V, 60 s
Linear law (B)
210 ° (1 turn)
- 55 ∼ 125 °C
10 Ω ∼ 2 MΩ
Soldering Zone
For technical questions contact: copalsupport@vishay.com
smaller
smaller
± 20 %
-6
-6
/°C maximum
/°C maximum
ENVIRONMENTAL SPECIFICATIONS
Test item
Thermal shock
Humidity
Shock
Vibration
Load Life
Low
temperature
operation
High
temperature
exposure
Immersion seal
Soldering heat
the temperature in a pot
board, 5 ∼ 6 s, two times
immersion from head of
70 °C, 0.125 W, 1000 h
260 °C, 10 s or 215 °C,
6 directions for 3 times
Flow: 260 °C ± 3 °C as
Acceleration 196 m/s
terminal to backside of
Amplitude 1.52 mm or
- 10 ∼ 65 °C (Relative
3 directions, 12 times
- 65 ∼ 125 °C (0.5 h),
humidity 80 ∼ 98 %),
temperature 255 °C
350 ± 10 °C, 3 ∼ 4 s
(Please refer to the
Manual soldering:
Test conditions
10 cycles, 240 h
of molten solder,
981 m/s
10 ∼ 2000 Hz,
125 °C, 250 h
profile below.)
Reflow: Peak
- 55 °C, 2 h
85 °C, 60 s
maximum
5 cycles
Sn-Pb
each
each
S-Cu
35 s
2
, 6 ms
2,
continuous bubbles)
Specifications
No leaks (No
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 1 %]
[ΔR/R ≤ 3 %]
[ΔR/R ≤ 2 %]
[ΔR/R ≤ 3 %]
[ΔR/R ≤ 1 %]
[S.S. ≤ 1 %]
[S.S. ≤ 1 %]
[S.S. ≤ 1 %]
[S.S. ≤ 2 %]
[S.S. ≤ 2 %]
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