CC25-2405SR-E TDK Corporation, CC25-2405SR-E Datasheet - Page 25

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CC25-2405SR-E

Manufacturer Part Number
CC25-2405SR-E
Description
CONV DC/DC 25W SNGL 24V 5V SMD
Manufacturer
TDK Corporation
Type
Isolatedr
Datasheet

Specifications of CC25-2405SR-E

Output
5V
Number Of Outputs
1
Power (watts)
25W
Mounting Type
Surface Mount
Voltage - Input
18 ~ 36V
Package / Case
30-DIP Module (25 Leads)
1st Output
5 VDC @ 5A
Size / Dimension
1.77" L x 1.70" W x 0.28" H (44.9mm x 43.2mm x 7mm)
Power (watts) - Rated
25W
Operating Temperature
-40°C ~ 85°C
Efficiency
90%
Approvals
CSA, cUL, EN, UL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
4th Output
-
Other names
CC252405SRE
Q4487931

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CC25-2405SR-E
Manufacturer:
TDK
Quantity:
30
・All specifications are subject to change without notice.
For products other than with 10W, capacitors are not con-
nected between the primary GND and the secondary GND.
To reduce common mode noise, connect a capacitor with
around 1000pF between the primary GND and the second-
ary GND, as shown in the figure below.
In this case, note that if the capacitor that is connected is
too large, coupling capacitance between input and output
becomes large.
Also be careful about the withstand voltage of the capacitor
(500V or over is desirable with consideration of the insula-
CC-E
2-5. Common mode noise
tion withstand voltage).
For products with 10W, capacitors with 1000pF are inter-
nally connected between primary and secondary.
3-1. Soldering conditions
●Soldering conditions
 DIP models / SIP models
Observe the following conditions in soldering board.
Solder dip
Soldering copper
SMD models
Lead-free soldering / High-temperature reflow process
Surface temperature of parts
245 ˚ C max.
225 ˚ C min.
180 ˚ C
150 ˚ C
1 to 3 ˚ C/s
+Vin
–Vin
40 to 100s
3. Soldering conditions/Cleaning conditions
+Vout
–Vout
260°C, 10s max.
380°C, 3s max.
1 to 4 ˚ C/s
30 20s
1 to 5 ˚ C/s
2-6. Radiation noise
Radiation noise of the converter can be reduced by con-
necting the case terminal to the input or output GND ter-
minal. The effectiveness varies depending on the device.
Check it on the actual device.
Regarding wiring, use GND line and solid pattern for the
bottom of the converter as much as possible.
- SMD models are not equipped with case terminals.
3-2. Cleaning method
Board cleaning after soldering is not recommended. How-
ever, the cleaning fluids and conditions shown in the table
below have been tested and proved to have no problem.
These fluids and conditions can be used. Consult us for
using cleaning fluids other than those shown below.
Cleaning fluids and test conditions
Cleanthrough 750H
Pine alpha ST100S
Terpene Cleaner EC-7R
Isopropyl alcohol
Asahiklin AK-225AES
(1) Cleaning (shaking) at 60° C for 4 minutes
(2) Rinsing (shaking in water) at 60° C for 4 minutes
(3) Rinsing (shaking in water) at ordinary temperature -
40° C for 4 minutes
(4) Drying at 70° C for 6 minutes
(1) Cleaning (shaking) at 60° C for 5 minutes
(2) Rinsing (shaking in water) at 30° C for 3 minutes
(3) Drying at 70° C for 6 minutes
(1) Cleaning (shaking) at 60° C for 5 minutes
(2) Rinsing (shaking in IPA) at 30° C for 10 minutes
(3) Drying at 70° C for 6 minutes
(1) Ultrasonic waves at 60° C for 1 minute
(2) Cool bath cleaning R.T. for 1 minute
(3) Vapor cleaning at 83° C for 1 minutes
(1) Ultrasonic waves at 50° C for 2 minutes
(2) Cool bath cleaning R.T. for 2 minutes
25

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