AV60C-048L-050F06-8 Emerson Network Power, AV60C-048L-050F06-8 Datasheet - Page 23

• Manufacturer Part Number: AV60C-048L-050F06-8
• Description: CONV DC-DC 30W 48VIN 5V POS-EN
• Manufacturer: Emerson Network Power
• Series: AV60Cr
• Type: Point of Load (POL) Non-Isolatedr

Specifications of AV60C-048L-050F06-8

• Output: 5V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module, 1/2 Brick
• 1st Output: 5 VDC @ 6A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 30W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 87%
• Approvals: CSA, EN, UL
• 3rd Output: -
• 2nd Output: -
• Other names: AV60C-048L050F068

TEL:
FAX:
USA
1-760-930-4600
1-760-930-0698
The heat sinks mount to the top surface of the
module with screws torqued to 0.56 N-m (5 in.-
lb). A thermally conductive dry pad or thermal
grease is placed between the case and the
heat sink to minimize contact resistance (typi-
cally 0.1° C/W to 0.3° C/W) and temperature dif-
ferential.
Nomenclature for heat sink configurations is as
follows:
where:
For example, WDT5040 is a heat sink that is
transverse mounted (see Figure 29) for a 61
mm x 57.9 mm (2.4 in.x 2.28 in.) module with a
heat sink height of 0.5 in.
Heatsink Mounting Advice
A crucial part of the thermal design strategy is
the thermal interface between the case of the
module and the heatsink. Inadequate mea-
sures taken here will quickly negate any other
attempts to control the case temperature. For
example, using a conventional dry insulator can
result in a case-heatsink thermal impedance of
>0.5° C/W, while use one of the recommended
Heatsink Mounting Advice
WDxyyy40
x = fin orientation: longitudinal (L) or trans
yyy = heat sink height (in 100ths of inch)
verse (T)
Fig.30 Heat Sink Mounting
A A
A A
V V
V V
Europe
44-(0)1384-842-211
44-(0)1384-843-355
6 6
6 6
3 3
3 3
0 0
0 0
6 6
6 6
C C
C C
V V
V V
D D
D D
H H
H H
C C
C C
a a
a a
l l
l l
t t
t t
f f
f f
o o
o o
-
-
B B
B B
7 7
7 7
r r
r r
5 5
5 5
i i
i i
c c
c c
V V
V V
k k
k k
D D
D D
S S
S S
C C
C C
i i
i i
z z
z z
I I
Asia
852-2437-9662
852-2402-4426
I I
n n
n n
e e
e e
p p
p p
D D
D D
u u
u u
C C
C C
t t
interface methods (silicon grease or
pads available from Avansys) can result in a
case-heatsink thermal impedance
0.1°C/W.
Natural Convection with Heat Sink
The power derating for a module with the heat
sinks ( shown as figure 27 to figure 29) in nat-
ural convection is shown in figure 31. In this
test, natural convection generates airflow about
0.05 m/s to 0.1 m/s ( 10ft./min to 20ft./min ).
Figure 31 can be used for heat-sink selection in
natural convection environment.
For example how to select a heat sink?
What heat sink would be appropriate for a
AV60C-048L-050F06 in a natural convection
environment at nominal line, 3/4 load, and max-
imum ambient temperature of 80°C?
Determine P
dition:
Get: P
Determine Heat Sink ( Fig.31 ):
1 1/2 in. allows up to T
t t
Natural Convection with Heat Sink
, ,
, ,
-
-
Fig.31 Heat Sink Power Derating Curves,
D D
D D
3 3
3 3
V
I
T
0 0
C C
0 0
C C
6
5
4
3
2
1
0
O
A
30
I
W W
W W
= 3/4 (6.0) = 4.5 A
= 48 V
D
= 80 °C
C C
C C
= 3.2 W
O O
o o
O O
o o
With 1 1/2 in. heatsink
n n
40
n n
u u
www.astec.com
u u
With 1 in heatsink
v v
v v
With 1/2 heatsink
With 1/4 heatsink
t t
Ambient Temperature, T
t t
Without heatsink
Natural Convection
D
p p
e e
p p
e e
( referenced Fig.22 ) with con-
u u
r r
u u
r r
50
t t
t t
t t
t t
e e
e e
r r
r r
s s
s s
60
A
= 82°C
70
A
80
(° C)
90
thermal
around
100
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