MCP212XDM Microchip Technology, MCP212XDM Datasheet - Page 16

• Manufacturer Part Number: MCP212XDM
• Description: BOARD DEVELOPMENT IRDA
• Manufacturer: Microchip Technology

Specifications of MCP212XDM

• Main Purpose: Interface, IrDA
• Utilized Ic / Part: MCP2120, MCP2122
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP2120, MCP2122
• Core Architecture: PIC
• Core Sub-architecture: PIC18
• Kit Contents: MCP2120/22 Developers Board, Important Information Read First
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MCP2120/22 Developer’s Board User’s Guide
FIGURE 1-5:
DS51842A-page 12
Baud Rate
Jumper to specify operation of PIC18F65J50 firmware
JMP6
0
1
MCP2122
2
Device:
3
9600 Baud
19200 Baud
38400 Baud
Reserved
Reserved
28800 Baud
57600 Baud
115200 Baud
4
1.3.3
Figure 1-5 shows the MCP2122 JMP6 program setting for the MCP2120/22 board.
MCP2122 JMP6 FIRMWARE OPERATION
5
6
N.A.
Firmware Program Jumper Descriptions for MCP2122
7
Program
Reserved
Reserved
Reserved
PIC streams data from table
PIC echos received Data
Data Passes through PIC, UART1 Baud
determined by JMP8, UART2 @ 115200
Data Passes through PIC, UART1 &
UART2 at same Baud Rate
16XCLK Only
© 2009 Microchip Technology Inc.